TOKYO, Japan – June 23, 2026 – Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) and OpenLight, a leader in heterogeneous silicon photonics integration and custom Photonic Application-Specific Integrated Circuit (PASIC) design, Today announced their plans to partner and develop solutions for scalable, high-volume silicon photonics testing.
As AI and high-performance computing workloads grow, data centers are increasingly adopting silicon photonics and co-packaged optics technology to deliver the bandwidth, latency, and power efficiency required by next-generation AI applications. To support this shift, Advantest will work with OpenLight to address the unique challenges of high-volume electro-optical device (e.g., Optical Engine) testing. Through this collaboration, Advantest and OpenLight aim to establish an end-to-end test solution for high-volume manufacturing, enabling scalable production of next-generation silicon photonics devices and accelerating the adoption of optical interconnect technologies for data centers and high-speed networking applications.
“We work closely with our foundry partners to design and manufacture innovative PASICs to support the advancement of AI technology,” said Adam Carter, CEO of OpenLight. “We are pleased to collaborate with Advantest as part of this ecosystem. Their leadership in test will allow us to offer sophisticated solutions that deliver customer value and address demands for high-volume manufacturing.”
“As we broaden our silicon photonics capabilities, we are pleased to partner with OpenLight to accelerate end-to-end semiconductor technology development,” said Doug Lefever, representative director and group CEO of Advantest Corporation. “As AI and high-performance computing continue to drive demand for greater bandwidth and energy efficiency, this partnership enables us to innovate test solutions that help customers scale production and help bring next-generation photonic technologies to market faster, meeting the needs of the AI era.”
