News Summary
- At electronica 2026 in Munich, Germany, LITEON presents its optoelectronic semiconductor technologies under the theme “Intelligent Photonics,” showcasing a diverse portfolio of innovations and solutions spanning optical communications and optoelectronic semiconductors.
- Advancing high-speed optical interconnects for AI data centers: LITEON showcases its VHP External Laser Source (ELS) technology and ELSFP solutions supporting next-generation optical interconnect architectures including CPO and NPO, providing a high-performance and scalable optical communications platform for future data centers.
- Extending from high-speed interconnects to power applications: LITEON demonstrates key technologies including 800 VDC, Isolation Amplifiers, and Gate Drivers to support high-power conversion, signal sensing, and control requirements in AI data centers.
- Expanding intelligent sensing and AR optics applications: LITEON showcases ToF, SWIR, Metalens, MicroLED, Waveguide, and other advanced technologies for applications including robotics, machine vision, industrial automation, smart wearables, and immersive computing.
- Positioning as a “Digital Photonics Integrator”: By integrating capabilities from key components and optical modules to system-level applications, LITEON continues to expand its presence across high-growth markets including AI infrastructure, intelligent sensing, and high-efficiency energy management.
LITEON Technology (2301) participates in electronica 2026, held in Munich, Germany, from November 10 to 13, showcasing its optoelectronic semiconductor technologies under the theme “Intelligent Photonics.” The portfolio spans high-speed optical interconnects, high-efficiency isolation and power control, intelligent sensing, and AR optics, demonstrating LITEON’s broad deployment of core optoelectronic technologies across AI data centers, high-efficiency energy management, and intelligent applications.
“AI is accelerating the transformation of computing and energy infrastructure, while driving growing demand for high-speed, low-power, and highly reliable optical connectivity,” said Sander Su, General Manager of LITEON’s Optoelectronics Products Solutions. “With deep expertise in optical communications and optoelectronic semiconductors, LITEON is positioning ourselves as a Digital Photonics Integrator, continuously integrating technologies across key components, modules, and system-level applications to help customers address the growing demands for high-speed transmission, greater efficiency, and intelligent sensing in the AI era.”
High-Speed Optical Interconnect Technologies Accelerate AI Data Center Upgrades
As AI computing continues to scale rapidly, data centers require higher bandwidth, lower latency, and greater energy efficiency, accelerating the development of next-generation optical interconnect architectures such as Co-Packaged Optics (CPO) and Near-Packaged Optics (NPO).
In response to this trend, LITEON showcases its VHP External Laser Source (ELS) technology and ELSFP solutions supporting CPO and NPO switch architectures, providing high-performance, scalable optical connectivity for AI clusters and future data centers. Designed to accommodate different system configurations, liquid-cooling architectures, and integration requirements, the solutions help customers build more efficient AI networking infrastructure.
LITEON also presents its ELS technology roadmap, comprehensive optical communications portfolio, and liquid-cooled ELSFP demonstration platform, highlighting its integrated capabilities spanning key optical technologies, module design, and system-level applications. Through these innovations, LITEON continues to strengthen its high-speed optical interconnect portfolio and capture emerging opportunities driven by the evolution of high-speed connectivity in AI data centers.
From High-Speed Optical Interconnects to High-Efficiency Isolation and Power Control, Optoelectronic Technologies Advance AI Data Center Infrastructure
As AI computing performance and cluster scale continue to increase, the demand for high-speed data transmission is rising alongside the transition toward higher-power and more efficient data center power architectures. Leveraging its strengths in optoelectronic semiconductor technologies, LITEON showcases isolation and power control technologies for 800 VDC power systems and AI data center power architectures. Extending its capabilities from high-speed optical interconnects to power conversion and control, LITEON demonstrates how its core optoelectronic technologies can support both data transmission and power management across AI data centers.
The portfolio includes key components such as Isolation Amplifiers, Gate Drivers, high-speed Photocouplers, Photo Relays, and reinforced isolation platforms, providing safe and reliable power conversion as well as precise signal sensing and control in high-voltage, high-power environments. These technologies also extend to applications including solar inverters, battery management systems, EV charging equipment, and industrial automation, helping customers enhance system safety, reliability, and energy efficiency while expanding the applications of LITEON’s core optoelectronic semiconductor technologies across AI, smart energy, and industrial infrastructure.
Intelligent Sensing and AR Optics Expand Next-Generation Applications
AI is not only transforming data center infrastructure but also accelerating the development of robotics, automation, and smart wearable devices, increasing the importance of high-precision sensing and advanced optical technologies. In intelligent sensing, LITEON showcases advanced optical technologies including Multi-Zone ToF, Direct ToF, Metalens Dot Projectors, and SWIR sensing, addressing applications across robotics, machine vision, industrial automation, autonomous navigation, and AR/VR devices. With high-precision sensing and real-time environmental perception, these technologies help systems achieve greater automation, operational efficiency, and decision-making capabilities.
In addition, LITEON also showcases its next-generation AR optical module technologies, including MicroLED display modules, full-color light engines, Waveguide integration technologies, and AR optical system design capabilities. These innovations demonstrate LITEON’s ability to extend its optoelectronic semiconductor expertise from sensing components to optical modules and system integration, further expanding its presence in emerging applications such as smart wearables and immersive computing.
LITEON Technology at electronica 2026:
l Date: November 10 – 13, 2026
l Venue: Messe München, Germany
l AI Power Booth: #124, Hall A5
l Intelligent Photonics Booth: #337, Hall B5