Hoofddorp, Netherlands 15th October, 2026: Murata Manufacturing Co., Ltd. has developed a D-band (110 to 170 GHz) antenna module through joint research, combining its ceramic substrate and packaging technologies with a beamforming integrated circuit (IC). The module has demonstrated wireless communication at 135 GHz, signal transmission using bandwidths of up to 8 GHz, and two-dimensional beam control for both transmission and reception.
The increasing use of physical AI, digital twins, and other technologies to collect, analyse, and act on large volumes of real-world data in real time is driving demand for faster, higher-capacity communications. Meeting these requirements depends on access to wider bandwidths, allowing more information to be transmitted. Existing mobile frequency bands are already shared with other wireless services, making it difficult to secure additional spectrum. Frequencies above 100 GHz are therefore being explored for future 6G systems, offering the potential for bandwidths spanning several gigahertz.
However, operating at these frequencies creates demanding design and integration challenges. As wavelengths become shorter, even small differences in wiring length and component placement can significantly affect communication performance. Antennas and high-frequency circuitry must therefore be designed and assembled with high precision, while maintaining the compact dimensions and suitability for mounting required for practical use.
Combining Ceramic Materials and Beamforming Technology
To address these challenges, Murata combines its advanced low-temperature co-fired ceramics (LTCC) substrate technology with a D-band-compatible beamforming IC developed by imec*. The module integrates the antennas with the high-frequency circuitry needed to transmit, receive, and control wireless signals.
The resulting module is the world’s first LTCC antenna module to support D-band operation and two-dimensional beam control for both transmission and reception**, enabling access to the wide bandwidths available above 100 GHz while directing radio beams horizontally and vertically to help maintain communication quality. The beamforming IC controls signals across multiple antennas to direct the beam toward the intended device.
Murata’s in house ceramic materials were optimised for this application to achieve a low dielectric constant and low dielectric loss, helping to reduce signal loss at frequencies above 100 GHz. Its high-frequency design and packaging expertise enables precise, high-density integration of the IC, antennas, and radio-frequency wiring, meeting the demanding assembly requirements at these frequencies while creating a compact, high-performance module suitable for mounting in equipment.
Advancing Toward Practical Implementation and Mass Production
The results demonstrate the feasibility of a key antenna module technology for future 6G systems, combining the wide bandwidths available above 100 GHz with beam control to support high-speed, high-capacity communications while maintaining communication quality. The technology could also support sub-terahertz radar sensing and integrated sensing and communication (ISAC), allowing the same wireless system to provide connectivity and detect its surroundings, including object positions and movement.
Drawing on its proven track record in LTCC mass production, Murata will advance development toward practical use and volume production, targeting commercialization from 2030 onwards.