UK-based Oxford Instruments and the Kavli Nanoscience Institute at the California Institute of Technology (CalTech) in Pasadena, CA, USA are holding a one-day workshop (‘Nanotech 2017: Pushing the limits’) at CalTech on 19 July that will explore recent progress in nanoscale plasma processing R&D, and look at future trends in the fabrication and application of micro-, nano- and atomic-scale structures and devices.
The agenda includes:
- Silicon Vacuum Tubes, by Max Jones, Scherer Group, Caltech;
- DRIE Etch – Black Silicon, by Karl Yee, Jet Propulsion Laboratory;
- Atomic Layer Etch (ALE): A precision technique to enable tomorrow’s technology, by Mike Cooke, Oxford Instruments;
- SiC Etch, by Andrei Faraon, Caltech;
- Atomic Layer Deposition (ALD) New developments for atomic scale processing, by Thomas Miller, Oxford Instruments;
- Growth of 2D Materials and Heterostructures, by Robert Gunn, Oxford Instruments;
- InP Etch, by Ryan Briggs, Jet Propulsion Laboratory;
- MEMs Processes, by Vladimir Aksyuk, NIST/CNST; and
- Recent advances in PECVD technology, by Hannah Morgan-Cooper, Oxford Instruments.
“At Plasma Technology we thrive on sharing experiences with our peers, and these events are an ideal opportunity to do just this,” says Frazer Anderson, strategic marketing & business development director at Oxford Instruments Plasma Technology (OIPT).
Attendance is free of charge and open to anyone working in industry or academia, but booking is essential.