Plasma-Therm LLC, and Trymax Semiconductor Equipment BV have entered into a distribution agreement for North America. The agreement gives Plasma-Therm the exclusive rights to distribute all of Trymax’s NEO products for ashing applications.
Agreement gives Plasma-Therm exclusive rights to distribute all of Trymax’s NEO products for ashing applicationsTrymax’s NEO products for ashing/etching, and de-scum serve the semiconductor industry for 150mm, 200mm and 300mm substrates. Plasma-Therm’s bridge tools are fully flexible for processing multiple different substrate types like Si, GaAs, SiC, LiN, LiT, eWLB and Taiko wafers from R&D to high volume markets.
Plasma-Therm and Trymax say that they can now address all ashing, polymer removal and dry cleaning applications in the served markets, for all wafer sizes including 12 inches.
This alliance will provide a full set of stripping technologies to customers in North America, from low temperature at 50degC to high strip rate at higher temperature.
“Partnering with Trymax allows Plasma-Therm to offer resist strip and ashing products which complement well our existing High Denisty Radical Flux (HDRF) technology which targets polymer removal and low damage surface treatment” commented Yannick Pilloux, business development manager at Plasma-Therm.
“The agreement with Plasma-Therm is a critical component to our North American expansion strategy,” said Ludo Vandenberk, Executive Vice President of Trymax Semiconductor Equipment. “By combining forces with Plasma-Therm, we are able to better serve U.S. Front-end, MEMS and Back-end manufacturers with solutions that span the ashing and non-critical etch process steps. We are eager to get started serving our customers with the competitive advantages that our technologies can offer.’’