- Suchi Semicon has introduced two new semiconductor packaging product lines, QFN Packages and Power Packages, to expand its advanced packaging portfolio.
- The QFN range comprises QFN, uQFN, DFN and XFN formats, while the Power Package range includes DPAK, TO-series and IPAK suited for high-current and high-temperature operations.
- The new products are intended for applications across consumer electronics, automotive electronics, industrial systems, EV technologies, power devices and IoT solutions.
- Manufacturing will be carried out at Suchi Semicon’s Surat facility, with both product lines scheduled to be available to customers from January.
- The company highlights increasing market demand for compact, high-performance and SiC-ready semiconductor packaging solutions.
India, 02nd December 2025 – Suchi Semicon, Gujarat’s first semiconductor OSAT company, has launched its new QFN family (QFN, uQFN, DFN, XFN) and advanced Power Packages (DPAK, TO-Series, IPAK), further expanding its portfolio of semiconductor packaging solutions. These new product lines have been developed to support the fast-growing needs of consumer electronics, automotive, EVs, solar energy, industrial systems, and IoT devices. With this launch, Suchi Semicon aims to give chip designers and device makers reliable, high-quality backend packaging made in India, reducing the need to depend on overseas suppliers.
Started its production in January 2025, the new product families are built on months of R&D and process refinement by Suchi Semicon’s engineering teams. The company has focused on creating packaging that helps customers improve performance, manage heat better, and build smaller and more efficient products. The QFN family brings compact, high-density packaging that fits easily into today’s slim devices, while the Power Packages are designed for heavy-duty use where chips must handle high current and high temperatures without failure. Both lines reflect Suchi Semicon’s aims to offer solutions that meet global standards while being cost-effective and locally manufactured.
Ashok Mehta, Founder and MD of Suchi Semicon, said, “The semiconductor industry is entering a phase where both performance and reliability are becoming equally important. Devices are getting smaller, faster, and far more connected, which means packaging has now become a critical part of the value chain, not just a support function. As India pushes to build a strong semiconductor ecosystem, there is a clear need for advanced, locally available OSAT capabilities that can match global quality while offering faster turnaround and closer collaboration.”
“With the launch of our new QFN family and Power Packages, we are taking a step toward addressing that need. These products have been designed to support everything from everyday electronics to high-power EV and industrial applications. Our focus has been simple: deliver stable performance, robust reliability, and future-ready technology. We believe this launch strengthens our role in India’s semiconductor journey and brings us closer to our vision of becoming a trusted global OSAT partner,” he said.
The new QFN packages focus on high-density, compact chip packaging for everyday electronics. They allow chipmakers to fit more performance into smaller devices while keeping heat low and reliability high. The QFN line supports ultra-thin wafers, multiple attach options, fine-pitch gold and copper wire bonding, automated inspection, and a zero-delamination process ensuring stable, long-lasting chip performance across various applications.
The Power Package family is designed for high-current, high-temperature devices used in EVs, solar inverters, motor drives, power supplies, and industrial equipment. With SiC wafer capability, soft-solder die attach, thick aluminium wire bonding, and automotive-grade reliability readiness, these packages help power devices run cooler, last longer, and maintain performance even in harsh environments.
The new QFN and Power Packages support customers across consumer electronics, IoT, automotive electronics, EV systems, industrial automation, and renewable energy. By adding these advanced package types, Suchi Semicon aims to serve a wider set of applications and strengthen India’s semiconductor backend capabilities. Both product families will be built at Suchi Semicon’s Surat OSAT facility, which is equipped for high-volume production, fast turnaround, and strict reliability control. The company will supply the packages directly to domestic and international customers starting in January.
With this launch, Suchi Semicon continues to expand its portfolio and move further up the semiconductor value chain, supporting India’s goal of building a strong and reliable semiconductor manufacturing ecosystem.