TDK announces suite of sensing solutions for smart home applications

June 24, 2025

TDK Corporation (TSE:6762) announces a suite of InvenSense sensing solutions for intelligent smart home applications that require precise detection of presence, proximity, sound, tilt, liquid levels, acceleration, or motion. TDK’s ultra-low power sensors – including MEMS microphones, IMUs, and ultrasonic time-of-flight (ToF) – provide the data needed for today’s AI-enabled home technology.

TDK will present its MEMS and magnetic sensor solutions this week, June 25-26, at Sensors Converge 2025 at the Santa Clara Convention Center (Booth #722).

“MEMS sensors are the foundation of the connected smart home. With our suite of smart home sensing solutions, TDK is uniquely positioned to drive innovation and enhance daily life,” said Fabio Pasolini, VP and GM of the emerging sensors business at InvenSense, a TDK Group company.

With its partner-first approach, TDK offers an array of solutions depending on customers’ needs.

TDK custom sensing solutions for smart home include:

TDK smart home solutions available at distributors globally include:

More on SmartSonic 
Now available at multiple distributors worldwide, the SmartSonic ultrasonic time-of-flight ICU-30201 enhances the contextual awareness of products that require accurate presence, proximity, and distance measurements, such as household robotics, drones, alarm devices, door locks, camera devices, smart building systems, and more. It also embeds a more powerful on-chip processor with higher computational power – all at ultra-low power for energy efficiency. The ICU-30201 is available in an ultra-compact package footprint of 5.17 x 2.68 x 0.9 mm3. Also available at global distribution are the SmartSonic ICU-20201 and ICU-10201.

For additional information or to request samples for any of our smart home solutions, please visit https://invensense.tdk.com/smart-home or contact InvenSense Sales inv.sales.us@tdk.com.