TDK launches industry-leading low-resistance soft-termination C0G MLCCs with 22 nF at 1000 V in the 3225 case size

September 18, 2025

TDK Corporation (TSE:6762) announced today it expanded its CN series of low-resistance soft-termination MLCCs. This product achieves an industry-leading* 22 nF capacitance in the 3225 case size (3.2 x 2.5 x 2.5 mm – L x W x T) and C0G characteristics at 1000 V. Mass production of the product series began in September 2025. The capacitors of the CN series are industry-first products that are equivalent to regular products in terms of their terminal resistance due to the optimization of their resin electrode structure.

In recent years, there has been an increase in the use of multiple resonance capacitors placed in series-parallel circuits for resonance applications such as LLC resonant circuits and wireless charging. As applications become more powerful, they require more resonance capacitance, which increases the demand for high-voltage, large-volume capacitors. To improve reliability in these applications, components with resin electrodes effectively prevent placement cracks resulting from external stress. However, the increased resistance value of resin electrodes has been an issue.

This led TDK to develop the CN series with optimized resin electrode structures, resulting in significantly lower resistance values. In addition to the low losses and capacitance stability over temperature and voltage variations of C0G products, these resin electrode structures achieve both high reliability against external stress and reduced loss, making them ideal for use as resonator and snubber capacitors.

The optimization of product and process designs has made it possible to manufacture these products, which helps increase reliability and application to high-voltage circuits and enhances the reliability of the applications. TDK will continue to expand its product line to meet the needs of its customers.

* As of September 2025, according to TDK

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