Infineon introduces the new AIROC™ CYW20829 Bluetooth® LE system on chip
Munich, Germany – 4 January, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching the AIROC™ CYW20829...
Munich, Germany – 4 January, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching the AIROC™ CYW20829...
ST’s latest-generation silicon-carbide (SiC) power devices extend leadership in performance and reliability for e-mobility and energy-efficient industry Continued long-term investment...
Dec 24, 2021 STMicroelectronics has announced new STM32Cube software packs and tools, as well as evaluation boards, to accelerate development...
Munich, Germany, and El Segundo, California – 23 December 2021 – Next Saturday, 25 December, NASA plans to launch James...
Nordic’s Matter solutions, Thingy:53, LE Audio development kit, Thingy:91 and nRF Cloud Location Services power a range of innovative demonstrations...
Munich, Germany, and Las Vegas, USA – December 22, 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today...
San Diego, CA, 21 December, 2021 : congatec – a leading vendor of embedded and edge computing technology – is...
December 21, 2021, Łódź, Poland – Transfer Multisort Elektronik (TME), the Poland-based component distributor, has further strengthened its portfolio of...
December 21, 2021 TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the...
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