Technology

Rohde & Schwarz in collaboration with Qualcomm Technologies, Inc. has completed an early verification step for 3GPP Rel. 17 Search...

New partnership will bring Everspin 256Mb PERSYST MRAM into Teledyne HiRel Semiconductors’ memory solutions for mission-critical systems CHANDLER, Ariz., and...

Munich, Germany – 31 August 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) radiation-hardened HiRel power devices are...

Collaboration combines AEROFUGIA’s advanced eVTOL platform with SYSGO’s certifiable real-time operating system and hypervisor technology to enable safe, consolidated and...

Building US capacity in advanced semiconductor materials: Space Forge selects The Texas A&M University System as manufacturing base Agreement sets...

Monojit Samaddar, Country Director, VIAVI Artificial intelligence is rapidly reshaping telecommunications, evolving from a tool for automating discrete tasks into...

Bangalore - August 13, 2026 – VIAVI Solutions has announced the latest, enhanced version of the Vertex channel emulation platform. With 400 MHz...

Industry leaders share practical strategies for accelerating innovation, improving productivity and scaling engineering capabilities with AI BANGALORE, India (July 29,...

New NI Nigel AI capabilities embed context-aware AI authorship across the NI LabVIEW+ Suite, extending productivity gains to engineers globally...

Investment Will Expand Technology, Talent and Infrastructure as Marvell Celebrates 20 Years of Engineering Innovation in India Bangalore, India – July...