Technology
Teradyne Opens Office in India, Deepening Commitment to the Country’s Growing Semiconductor Ecosystem
New Bengaluru office reflects Teradyne’s long-term investment in India’s semiconductor and electronics manufacturing industry BENGALURU, India — Sept. 15, 2026...
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element14 Expands Access to Emerson’s NI Nigel AI, Helping Test Engineers Accelerate Development with Purpose-Built AI
Bengaluru, India – 17 September, 2026 – element14 is expanding access to Emerson's NI Nigel™ AI, a purpose-built AI technology for test...
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DigiKey Sponsors electronica India Tech Challenge 2026
Winning engineering team will receive more than ₹5 lakh igiKey is sponsoring the electronica India Tech Challenge 2026, which culminates...
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Harwin Strengthens High-Reliability Offering with Acquisition of KEC
Deal extends portfolio of products and services for mission-critical aerospace, defence and industrial applications Harwin has announced that it has...
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VIAVI to Showcase Data Center Testing Portfolio at ECOC 2026
Bangalore - September 10, 2026 – VIAVI Solutions will showcase its end-to-end data center portfolio for foundational silicon technologies, modules and systems testing...
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Fujitsu develops diamond-spin quantum computer prototype
New diamond-spin quantum computer prototype incorporating tin-vacancy (SnV) centers into photonic integrated circuits marks significant step toward quantum computing scalability...
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Rohde & Schwarz has achieved initial verification of 3GPP Rel. 17 power-saving feature SSSG for 5G NR
Rohde & Schwarz in collaboration with Qualcomm Technologies, Inc. has completed an early verification step for 3GPP Rel. 17 Search...
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Everspin Technologies and Teledyne HiRel Semiconductors Partner to Accelerate MRAM Adoption in Aerospace and Defense Applications
New partnership will bring Everspin 256Mb PERSYST MRAM into Teledyne HiRel Semiconductors’ memory solutions for mission-critical systems CHANDLER, Ariz., and...
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Infineon HiRel power semiconductors support successful launch of NASA Nancy Grace Roman Space Telescope
Munich, Germany – 31 August 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) radiation-hardened HiRel power devices are...
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AEROFUGIA and SYSGO advance Certification-ready Avionics for the AE200-100 eVTOL
Collaboration combines AEROFUGIA’s advanced eVTOL platform with SYSGO’s certifiable real-time operating system and hypervisor technology to enable safe, consolidated and...
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