Research

Built with revolutionary “nanostack” 3D chip architecture, IBM’s sub-1 nm chip to propel semiconductor industry forward for the next decade...

Innovations spanning advanced packaging and DRAM enable the 3D architectures behind cutting-edge AI chips New CMP and deposition systems target...

Growth Driven by Robust Investments in Leading-Edge Logic, DRAM, and Packaging Technologies to Support AI Wave   MILPITAS, Calif. – December 2, 2025 – SEMI, the industry association...

JSR Corporation/Inpria Corporation and Lam Research Enter Cross Licensing and Collaboration Agreement to Advance Semiconductor Manufacturing Companies to Focus on...

Amid India's fast-growing semiconductor sector—expected to reach USD 79.20 billion by FY2031, the global industry is poised to become a...

Tokai University, Toyohashi University of Technology, Chubu University, and Denso Corp., with support from the Japan Agency for Medical Research...

New chip milestone to propel major leaps forward in performance and energy efficiency ALBANY, N.Y., May 6, 2021 /PRNewswire/ --...

Devices that can see shortwave infrared light, which is invisible to the naked eye, could soon become cheaper and more...

TOKYO, Apr 1, 2021 - RIKEN and Fujitsu today announced the opening of the "RIKEN RQC-Fujitsu Collaboration Center" to promote...

Collaboration with L3Harris Technologies, a leading technology innovator that solves mission-critical challenges. Nano Dimension and L3Harris have created innovative methods...