As artificial intelligence models grow exponentially, they are running into a massive, terrestrial bottleneck: Earth is simply running out of...
Read moreDetailsMunich, Germany – 8 October 2026 – Artificial intelligence workloads are redefining the power requirements of modern data centers. Increasing...
Read moreDetails800V-to-6V reference design combines digital power control and hardware-based security to help accelerate high-efficiency OCP rack power development National, 06th...
Read moreDetailsAcquisition strengthens Infineon’s leadership in power solutions for AI data centers and accelerates software-defined power architectures from grid to core...
Read moreDetailsSolution combines digital power control, GaN technology, and hardware-based security to accelerate development of high-efficiency rack power systems based on...
Read moreDetailsAMD Ross agentic AI assistant spans software, silicon and board design to dramatically accelerate embedded system design, optimization, debug and...
Read moreDetailsDual-side cooling (DSC) shrinks package footprint by 57% compared with TOLT, packing more power into space-constrained megawatt-scale racks. One of the lowest on resistances in the 650V class, at 20 mΩ in an 8x8 mm package. Single-source path to 800V designs with industry-standard PQFN footprint plus full controller, driver and MCU...
Read moreDetailsCollaboration will include AI Data Center PSUs and AI infrastructure, combining Wise Integration’s digital control technology and Navitas’ wide-bandgap technologies...
Read moreDetailsNew AI agent leverages core EDA technologies to both create RTL from specifications and upgrade RTL with signoff‑grade quality and...
Read moreDetailsTrendForce expects server DRAM contract prices to rise by about 270% in total in 2026. HBM and RDIMM will together...
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