• Home
  • About Us
  • Contact Us
Semiconductor for You
  • Home
  • Semiconductor News
  • Technology
    • Automotive
    • Consumer Electronics
    • IoT
    • Lighting
    • Power Management
    • Wireless
    • Personal Electronics
    • Hardware & Software
    • Research
    • Medical Electronics
    • Embedded Design
    • Aerospace & Defence
    • Artificial Intelligence
  • DIY Projects
  • Market
  • Industries
    • Renesas Electronics
  • Knowledge Base
  • Events
  • Tools
    • Resistor Color Code Calculator
No Result
View All Result
  • Home
  • Semiconductor News
  • Technology
    • Automotive
    • Consumer Electronics
    • IoT
    • Lighting
    • Power Management
    • Wireless
    • Personal Electronics
    • Hardware & Software
    • Research
    • Medical Electronics
    • Embedded Design
    • Aerospace & Defence
    • Artificial Intelligence
  • DIY Projects
  • Market
  • Industries
    • Renesas Electronics
  • Knowledge Base
  • Events
  • Tools
    • Resistor Color Code Calculator
No Result
View All Result
Semiconductor for You
No Result
View All Result
Home Semiconductor News

DENSO and Kyoto spin-off FLOSFIA to develop gallium oxide-based power semiconductor device for EVs

Semiconductor For You by Semiconductor For You
January 9, 2018
in Semiconductor News
0
ADVERTISEMENT

Automotive supplier DENSO Corp of Kariya, Aichi prefecture, Japan, and Kyoto-based FLOSFIA Inc are partnering to develop a next-generation power semiconductor device that is expected to reduce the energy loss, cost, size and weight of inverters used in electric vehicles (EVs). Through the joint development project, the two firms aim to improve the efficiency of EV power control units (key to driving the widespread use of EVs).

Since 2007, DENSO has provided power control units (PCUs) for hybrid and electric vehicles, using an inverter to control the power supplied from the battery to the motor generator. To use electric energy more efficiently, energy losses during the DC to AC conversion by the inverter must be reduced, so DENSO is conducting R&D on low-loss power semiconductors.

FLOSFIA was spun off from Kyoto University in 2011 and specializes in R&D and commercialization of gallium oxide (α-Ga2O3) thin films formed by mist chemical vapor deposition (CVD). DENSO has also acquired new shares issued by FLOSFIA in its Series C funding round.

Kyoto University’s professor Shizuo Fujita pioneered the application of corundum-structured α-Ga2O3 for use in semiconductors. With a wide bandgap of 5.3eV and high electric breakdown field strength, α-Ga2O3 can better withstand high-voltage applications, making it possible to replace existing silicon and silicon carbide (SiC) power semiconductors.

Making use of physical properties of α-Ga2O3, FLOSFIA has developed low-loss power devices including a Schottky barrier diode (SBD) with what is claimed to be the lowest specific on-resistance on the market. The firm aims to develop its own production lines, targeting commercial production in 2018.

Content Protection by DMCA.com
Semiconductor For You

Semiconductor For You

Browse by Category

  • Aerospace and Defence
  • Articles
  • Automotive
  • Consumer-Electronics
  • Hardware & Software
  • Interview
  • IoT
  • Knowledge Base
  • Lighting
  • Market
  • personal-electronics
  • Power Management
  • Research
  • Semiconductor Events
  • Semiconductor News
  • Technology
  • Wireless
Semiconductor for You

Semiconductor For You is a resource hub for electronics engineers and industrialist. With its blend of
technology features, news and new product information, Semiconductor For You keeps designers and
managers up to date with the fastest moving industry in the world.

Follow Us

Browse by Category

  • Aerospace and Defence
  • Articles
  • Automotive
  • Consumer-Electronics
  • Hardware & Software
  • Interview
  • IoT
  • Knowledge Base
  • Lighting
  • Market
  • personal-electronics
  • Power Management
  • Research
  • Semiconductor Events
  • Semiconductor News
  • Technology
  • Wireless

Recent News

Infineon advances on 300-millimeter GaN manufacturing roadmap as leading Integrated Device Manufacturer (IDM)

Infineon advances on 300-millimeter GaN manufacturing roadmap as leading Integrated Device Manufacturer (IDM)

July 2, 2025

₹1 Lakh Cr RDI Scheme Approval

July 2, 2025
  • About
  • Advertise
  • Privacy & Policy
  • Contact

© 2022 Semiconductor For You

No Result
View All Result
  • Home
  • Semiconductor News
  • Technology
    • IoT
    • Wireless
    • Power Management
    • Automotive
    • Hardware & Software
  • Market
  • Knowledge Base
  • Tools
    • Resistor Color Code Calculator

© 2022 Semiconductor For You