Siemens’ Innovator3D IC software recognized for advancing 2.5D and 3D chiplet integration Siemens has won in the “Packaging: Design” category...

Hoofddorp, Netherlands, February 2026: Murata Manufacturing Co., Ltd. expands the ZENCROSSTM Alliance ecosystem with the addition of qualified engineering and development service...

FANUC India’s V Sriram Kumar appointed CEO; Hical’s Executive Chairperson Sujaya Shashikiran takes over as President Establishment of Electronics Centre...

Highlights-  AuraML partners with NVIDIA to build a multimodal world simulation platform for robotics and logistics Launches AuraSim,  India’s first...

Scalability and functional safety enabled by chiplet technology Auto-grade quality for large, modern AI NPUs Advanced power control for higher...

Achieves flexible, small-block configuration for large-scale TCAMs Cuts search energy and boosts speed through efficient search processing Enhanced functional safety...

Bangalore - Feb 19, 2026 - VIAVI Solutions has announced its demonstration lineup for Mobile World Congress (MWC) Barcelona 2026, which takes place March...

Multi‑billion-dollar collaboration strengthens supply chain resiliency and supports growing demand for chips powering smart vehicles and next-generation industrial systems MALTA,...

Devices Save Space While Maintaining High Reliability in Automotive, Industrial, and Telecommunications Applications MALVERN, Pa. — Feb. 18, 2026 — Vishay...

QSiC™Gen3 line featuring 1200V SOT-227, S3 half-bridge, B2T1 six-pack and B3 full-bridge packages on display at Booth #1451 February 18,...