Munich, Germany – 30 May 2022 – Augmented reality (AR) applications are about to fundamentally change the way we live...

Munich, Germany – 27 May, 2022 – Artificial intelligence (AI) at the edge will tremendously impact a number of industry...

Filogic 880 and Filogic 380 will drive the next generation of connectivity with the fastest and most reliable Wi-Fi 7...

Dimensity 1050 mmWave SoC highlights trio of new chipsets expanding MediaTek’s 5G and gaming portfolio HSINCHU, Taiwan – May 23,...

The Reference Design Enables OEMs to Build the Next Generation of Untethered Augmented Reality (AR) to Enable Immersive Experiences that...

UTAC Holdings Ltd. (UTAC), a global semiconductor test and assembly services provider, is announcing a punch copper (Cu) clip packaging...

SANTA CLARA, CA — May 17, 2022 — The Edge AI and Vision Alliance announced Blaize as winner of the...

RA Family of 32-bit Arm Cortex-M Microcontrollers Offers Ultimate IoT Security with Renesas's Secure Crypto Engine (SCE) and Arm TrustZone...

Combining proven GaN technology with innovative packaging expertise Nijmegen, May 19, 2022: Nexperia, the expert in essential semiconductors, has announced...

Sivers Semiconductors AB today announced that its subsidiary, Sivers Photonics, has signed a contract worth over $617k to deliver next...