Renesas to Invest and Restart Operation of Kofu Factory as 300mm Wafer Fab Dedicated for Power Semiconductors
Boosting Power Semiconductor Production Capacity in Response to Growing Demand for EVs TOKYO, Japan, May 17, 2022 ― Renesas Electronics...
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Infineon expands the LITIX™ Power family with a dual-channel DC-DC controller for full LED headlamps without a microcontroller
Munich, Germany – 18 May, 2022 – LED lighting is becoming more important in every car segment: It increases road...
32-Lane PCIe 3.0 Packet Switch from Diodes Incorporated Addresses Fan-Out and Multi-Host Connectivity
Plano, Texas – May 17, 2022 – Diodes Incorporated (Diodes) (Nasdaq: DIOD) today announced the introduction of a PCIe® 3.0...
Blaize and Innovatrics provide edge ready, low power, low latency Facial Recognition Technology!
Form strategic partnership for inference and edge AI ready-to-deploy Facial Recognition Technology El Dorado Hills, CA — May 16, 2022...
Avnet Silica to showcase innovative AI / ML technologies at embedded world
Featuring AI at the edge capabilities, in partnership with leading manufacturers Brussels, Belgium, 16 May 2022– Avnet Silica, an Avnet...
Infineon expands Prime Switch family with ultra-reliable Press Pack IGBT
For transmission and distribution applications and medium voltage drives Munich, Germany – 16 May, 2022 – Infineon Technologies Bipolar GmbH...
Nexperia further expands its offering of Clip-bonded FlatPower packaged diodes with new automotive CFP2-HP devices
Driving the transition in product packaging by investing in capacity and portfolio Nijmegen, May 16, 2022: Nexperia, the expert in...
Trackwise delivers space- and weight-saving flexible printed circuit cell-connecting interconnect for cell-to-pack EV batteries
New UK facility being built to deliver lightweight, convenient and space-saving flexible printed circuit technology in high volume to EV...
Nexperia launches new portfolio of application specific MOSFETs (ASFETs) for automotive airbags
Provides excellent transient linear mode performance using new SOA trench technology in LFPAK packaging providing designers with a smaller and...
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