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January 27, 2021

Based on the 32-bit Arm Cortex-M23 Core, 48 New RA2E1 MCUs Encompass a Wide Range of Memory, Operating Voltage and...

STMicroelectronics Extends MasterGaN® Family with New Device Optimized for Asymmetrical Topologies

June 7, 2021

January 28, 2021: Building upon the advantages of STMicroelectronics’ MasterGaN® platform, MasterGaN2 is the first in the new family to...

u-blox ALEX-R5 integrates cellular and GNSS technology into a miniature SiP form factor with zero compromises

January 26, 2021

The SiP features the secure u-blox UBX-R5 LTE-M / NB-IoT chipset and the u-blox M8 GNSS chip for size-constrained asset...

XP Power announces Pan-European distribution agreement with Distrelec

June 9, 2021

January 26th, 2021 – XP Power has signed a Pan-European distribution agreement with Distrelec. The new partnership will allow the...

24 V dual-channel low side EiceDRIVER™ with enable function and integrated thermal pad

May 27, 2021

Munich, Germany – 25. January 2021 – Infineon Technologies AG (FSE: IFX / QTCQX: IFNNY) broadens its EiceDRIVER™ portfolio with...

SEGGER’s J-Link OB plays crucial role in new BBC ‘HiFive Inventor’ educational kit

Monheim am Rhein, Germany – 21st January 2021 SEGGER's J-Link on-board debug probes can be found on hundreds of different...

Lattice Announces Training Center for Award-Winning FPGAs and Solution Stacks

Created in Partnership with Leading European FPGA Consulting Firm, Lattice Education Competence Center to Focus Exclusively on Lattice Technologies HILLSBORO,...

High power density, 10:1 ratio DC-DC converters in half- and quarter-brick footprint from Murata

Hoofddorp, Netherlands: Murata announces two new ultra-wide 10:1 ratio DC-DC converters, the 250W IRH-W80 half-brick and the 150W IRQ-W80 quarter-brick...

ADLINK Introduces a Portable PXI Express Chassis with Fast, Versatile Thunderbolt™ 3 Interfaces