congatec and Hacarus present AI kit based on Sparse Modeling
Deggendorf, Germany, 27 November 2019 - congatec - a leading supplier of high-performance embedded computing products - and the Japanese...
Deggendorf, Germany, 27 November 2019 - congatec - a leading supplier of high-performance embedded computing products - and the Japanese...
Stefan Sutalo, Director Product Marketing Passive Components at Rutronik Manchester, UK – 28 November 2019 – The world continues to...
Munich, Germany – 26 November 2019 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) sets another milestone in smart...
Fully encompassing both Wi-Fi 5 & Bluetooth® low energy 5. Thalwil, Switzerland – November 26, 2019 – u-blox (SIX:UBXN) continues...
Plano, Texas November 26, 2019 Diodes Incorporated today announced the dual-role PI3USB9201 USB BC 1.2 detector, which incorporates both host and...
The Audi e-tron FE06 in its new design Successful partnership in development intensified Waldenburg (Germany), 26 November 2019 – Last...
Qualcomm Technologies, Inc. and Siemens have setup a joint proof-of-concept project at the Siemens Automotive Test Center in Nuremberg, Germany,...
Düsseldorf, Germany, 26 November 2019 - Toshiba Electronics Europe GmbH today announced that Toshiba Electronic Devices & Storage Corporation Visconti™ 4 image recognition processor...
The newly developed low energy PAN1740A Bluetooth 5.0 module features a compact size and fast boot time for IIot and...
Rhett Evans, Senior Account Manager, Anders. CompuLab’s i.MX 8 System-on-Module family delivers true heterogeneous multicore processing and is ready to...
© 2022 Semiconductor For You