Infineon and Delta collaborate on high-density power modules to accelerate data center power architecture

Munich, Germany – 28 August 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the strengthening of its existing collaboration with Delta Electronics, Inc., in the development of state-of-the-art high-density power modules capable of enabling vertical power delivery to AI processors in hyperscale data centers. Together, the companies are taking a next step to drive decarbonization and digitalization in AI data centers further.

The partnership leverages Infineon’s ultra-thin silicon (MOSFET) chip technology and embedded packaging expertise, as well as Delta’s industry-leading power module design and manufacturing capabilities. This results in highly dense modules with exceptional efficiency to enable vertical power delivery (VPD) architecture to the xPUs in hyperscale data centers. The usage of vertical power delivery modules in comparison to a lateral mounted discrete solution can save up to 150 tons of CO₂ over an expected lifetime of three years per rack. Assuming that future hyperscale data centers will consists of up to 100 server racks, the amount of carbon dioxide saved is equivalent to the CO2 emissions of 4000 households per year.

“The close collaboration with Delta is a perfect example of complementarity – combining Infineon’s best-in-class silicon and packaging expertise with Delta’s superior module development capabilities,” said Adam White, Division President Power & Sensor Systems at Infineon. “Together, we’re offering tangible value to the hyperscalers, maintaining high efficiency and robustness while reducing cost and further driving decarbonization.”

“Our collaboration has resulted in the development of highly advanced VPD modules, which allows us to provide unparalleled power efficiency, reliability, and scalability for our customers,” said Ares Chen, Delta’s Vice President and General Manager of its Power and System Business Group. “We’re proud to be playing a key role in fostering energy conservation in the hyperscale data center power infrastructure ecosystem, and look forward to realizing significant contribution for the entire industry through our joint innovation.”

Infineon’s OptiMOS™ silicon-based 90 A integrated power-stage solution is being utilized by Delta to develop VPD modules. The use of vertical power delivery is a key factor in improving system efficiency as it allows for a more direct and compact power delivery path. By delivering power vertically, rather than horizontally, the VPD modules reduce power delivery network losses in the system. This, in turn, enables the modules to achieve higher power density and efficiency, while also reducing the amount of heat generated due to less power loss. Additionally, the vertical power delivery design also frees up space on the system board, allowing hyperscalers a more efficient use of space and the development of more compact and dense data center designs reducing total-cost of ownership.

As the AI era continues to advance, the demand for high-power data centers is increasing exponentially. To meet this demand, data centers require power delivery solutions that can support the growing power needs of AI training and inferencing applications. Furthermore, the increasing densification of IT racks, driven by the integration of tightly interconnected xPUs requires the development of higher voltage power distribution solutions that can efficiently deliver power to these high-density systems. In response to these challenges, Infineon and Delta are cooperating in the development of next-generation power delivery solutions for AI data centers that will require 1 megawatt (MW) per rack in the near future.

Alongside the company’s broad portfolio in gallium nitride (GaN) and silicon carbide (SiC) power solutions, Infineon is the global leader in silicon (Si) MOSFETs that are designed to enable best-in-class performance, reliability and ease-of-use in power switching, control and conversion. This means more efficiency, power density and cost effectiveness for products and system solutions.