Infineon Powers the Future of AI Data Centers with 800V Architecture

• Infineon’s hot-swap technology enables future server boards to operate in 800 Volt direct current (VDC) power architectures
• A combination of Infineon’s pioneering silicon carbide, gallium nitride and silicon technologies guarantees highest efficiency in future AI data centers
• Reliability, protection and reduced power losses are key levers to minimize total cost of ownership and carbon footprint of AI data center operators

Munich, Germany and Santa Clara, CA – 13 October 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) supports the 800 Volt direct current (VDC) power architecture announced by NVIDIA at Computex 2025 for AI infrastructure. The exponential growth of artificial intelligence is rapidly outstripping the capacity of the current 54 V data center power infrastructure. A shift to a centralized 800 VDC architecture allows for reduced power losses, higher efficiency and reliability. However, the new architecture requires new power conversion solutions and safety mechanisms to prevent potential hazards and costly server downtimes e.g. due to service and maintenance.

“There is no AI without power. That’s why we are working with NVIDIA on intelligent power systems to meet the power demands of future AI data centers while providing a serviceable architecture that reduces system downtimes to a minimum,” says Adam White, Division President Power & Sensor Systems at Infineon Technologies. “By driving the transformation towards high-density, reliable and safe 800 Volt powered data centers we are revolutionizing the way power is delivered to AI server racks. It’s our vision to maximize the value of every watt, ultimately paving the way for a more efficient and sustainable AI ecosystem.”

AI data center operators are investing heavily in high-performance computing for artificial intelligence, with projects like Stargate requiring massive capital expenditure (CAPEX) of billions of dollars. To guarantee a strong return on invest, it is crucial to maximize the uptime of AI server racks, which mandates a modular and scalable scheme for serviceability. Infineon and NVIDIA are collaborating on safety and service aspects such as the hot-swap controller functionality, which enables future server boards to operate in 800 VDC power architectures. Exchanging server boards on an 800 VDC bus while the entire rack continues operating requires a controlled pre-charging and dis-charging of the board. Infineon is supporting this with a dedicated solution based on the advanced semiconductor material silicon carbide (SiC). Enabled by the CoolSiC™ JFET technology data center operators can exchange server boards in an 800 VDC architecture while other servers continue to operate in the same rack. This mitigates the risk of downtimes and enables safe maintenance of server racks.

The switch to an 800 Volt direct current architecture is a major step forward to establishing powerful AI gigafactories of the future. The power consumption of an AI server rack is estimated to increase from around 120 kilowatts to 500 kilowatts – and to 1 megawatt by the end of the decade. As already announced in May 2025, Infineon will collaborate with NVIDIA on developing advanced power conversion solutions for accelerated computing platforms powered by 800 VDC. Infineon is leveraging its Intermediate Bus Converter (IBC) technology and high-frequency switching solutions based on gallium nitride (GaN) to accelerate the development of three- and two-stage conversion solutions from grid to core. Both approaches aim to provide the most suitable solution for data center operators reaching efficiency levels as high as 98 percent per conversion stage.

As the cost of an AI server is as much as 30 times higher than a traditional server, reducing power losses and ensuring high service uptime are key levers to reducing total cost of ownership and minimizing the carbon footprint of AI data center. Therefore, Infineon is providing full systems solutions including hot-swap controllers, reliable protection technology and highly efficient power conversion solutions based on all relevant semiconductor materials to enable efficient, safe, and sustainable operation of megawatt-scale AI server racks.

Meet Infineon at OCP Global Summit 2025 on October 15 at the session “Power Conversion Solutions for future Server Boards operating directly from HV DC” by Gerald Deboy, Fellow Infineon Technologies

Powering AI data centers will be discussed at Infineon’s OktoberTech Silicon Valley 2025. More information is available at www.infineon.com/event/oktobertech