New QSMP-25 solder-down module features next-gen STM32 MPU to enable secure edge AI in Industry 4.0 applications

QFN-style 29mm2 SoM offers dual ARM Cortex-A35, NPU, VPU, GPU & PCIe to combine intelligent edge processing with high-end multimedia capabilities

Oxfordshire, UK, July 2025: Direct Insight, the UK-based technical systems integrator focused on system-on-module (SoM) solutions, can now deliver and support development with QSMP-25 solder-down QFN-style SoMs (system-on-modules), featuring second-generation STMicro STM32 MPUs.

“This new QSMP-25 solder-down module delivers an industrial-grade 64-bit solution for secure Industry 4.0 and advanced edge computing applications that require high-end multimedia capabilities,” commented David Pashley, co-founder & Managing Director at Direct Insight. “Incorporating high performance connectivity, multimedia and display, with a Yocto-build mainline Linux BSP, this SoM simplifies design and production, with its QFN (quad flat no-lead) solder-down package optimising size and price, while simplifying PCB layout and EMI (electromagnetic interference) compliance.”

Manufactured by Direct Insight’s long-standing partner, Ka-Ro Electronics, the new QSMP-25 is a 29mm x 29mm QFN-style solder-down system-on-module featuring STMicroelectronics STM32MP255F microprocessors. Dual ARM Cortex-A35 processors, clocked at 1.5GHz, are complemented by a 400MHz ARM Cortex-M33 MCU (microcontroller), a 1.24 TOPS NPU (neural processing unit) for AI/ML (artificial intelligence/machine learning) tasks, dual MIPI-CSI camera inputs and a powerful GPU (graphics processing unit), as well as an HD 60fps video pipeline.

The QSMP-25 module adds 1GB LPDDR4 RAM, 4GB eMMC and power management, integrated on a tiny footprint QFN package for excellent EMC (electromagnetic compatibility), thermal and cost optimisations. The module is square, with a height of 2.6mm, and requires a single 3.3v supply. A full industrial operating temperature range of -40°C to +85°C is supported.

A wide range of interfaces is supported, including dual USB 2.0 (with on-module PHYs), or one USB 2.0 + one USB 3.0, PCIe and dual Gb Ethernet. Other connectivity includes 3x UART, 3x I2C, 2x SPI, PWM, SAI and 3x CAN. Advanced security features support IoT (internet of things) and industrial applications, ready for a CRA-compliant system implementation. The QSMP-25 comes with a dedicated Yocto Scarthgap build, providing a mainline Linux kernel, with full sources and toolchain supplied, as well as extensive documentation.

Learn more, download the datasheet, and order modules or development kits at: directinsight.co.uk/ka-ro-qsmp-25-solder-down-module-with-dual-core-stm32mp255/