Nexperia brings the benefits of clip-bonded FlatPower packaging to bipolar junction transistors

CFP15B package offers a compact and cost-efficient alternative to MJD series in DPAK package  

Nijmegen, July 16, 2025: Nexperia today announced the expansion of its bipolar junction transistor (BJTs) portfolio by introducing 12 new MJD-style BJTs in clip-bonded FlatPower (CFP15B) packaging. This new offering released as MJPE-series addresses the ongoing industry demand for more power-efficient and cost-effective designs in both industrial and automotive applications. Compared to traditional DPAK-packaged MJD transistors, MJPE-parts in CFP15B deliver significant board space savings and cost advantages without compromising performance.  

The new portfolio includes six automotive-qualified (e.g. MJPE31C-Q) and six industrial-grade types (e.g. MJPE44H11), with V_CEO ratings of 50 V, 80 V, and 100 V, and collector currents (I_C) of 2 A, 3 A, and 8 A. Both NPN and PNP variants are available. These BJTs complement Nexperia’s extensive CFP portfolio, which already includes a wide range of Schottky and recovery rectifier power diodes – another step toward standardizing footprints across multiple product categories streamlining PCB design and simplifying supply chains.

Used in diverse applications such as power supplies for battery management systems (BMS), on-board chargers in electric vehicles (EV), and back-lighting for video displays, the CFP15B-packaged BJTs maintain equivalent thermal performance (up to 175°C operation for automotive applications) while offering a 53% smaller soldering footprint. Furthermore, the clip technology of the CFP15B package supports exceptional mechanical robustness while also enhancing the electrical and thermal performance of these devices. 

“As the industry transitions to multi-layer PCBs, a trend driven by the increasing popularity of high-performance microcontrollers, packaging has become a crucial part of the thermal system,” according to Frank Matschullat, Product Group Manager Power Bipolar Discretes at Nexperia. “Modern CFP packaging technology, designed for multilayer PCBs, offers equal electrical performance in a considerably smaller footprint, helping to reduce part and overall system costs. Nexperia has substantially expanded its capacity to meet the increasing demand for CFP-packaged products that are essential for future-proofing automotive and industrial applications, including the MJPE series of BJTs.”

To learn more about Nexperia’s portfolio of bipolar junction transistors, visit: nexperia.com/MJPE