Infineon introduces new XENSIV™ TLE4971 sensor family for automotive applications
Munich, Germany – 4 November, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the addition of ...
Read moreMunich, Germany – 4 November, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the addition of ...
Read moreHighly Integrated RAA271082 PMIC Complements Renesas’ Award-Winning AHL Technology; Flexibility Enables Support for MCUs in Safety-Related Applications TOKYO, Japan, November ...
Read moreLinkSwitch-TN2Q supports 30-550 VDC input with integrated system-level protection San Jose, Calif. – August 24, 2022 – Power Integrations (NASDAQ: ...
Read moreProvides excellent transient linear mode performance using new SOA trench technology in LFPAK packaging providing designers with a smaller and ...
Read moreAnnouncing a new secure storage subsystem and key provisioning for the Wireless Power Consortium (WPC) Qi 1.3 Wireless Charging standard. ...
Read moreMar 17, 2021: STMicroelectronics is increasing the integration of automotive body electronics with the L99DZ200G door-zone system IC, which enables ...
Read moreMunich, Germany – 20 January, 2022 – Battery systems for 48 V are used in multiple, growing market categories including ...
Read moreNew A19360 will help automakers achieve levels 3, 4 and 5 automation in passenger vehicles Manchester, NH – Allegro MicroSystems, ...
Read moreMunich, Germany, and Las Vegas, USA – December 22, 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today ...
Read moreDec 1, 2021: To support the positioning market with state-of-the-art GNSS chipset and modules, STMicroelectronics has introduced the Teseo-VIC3DA, the ...
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