Nexperia introduces first 40-100 V automotive MLPAK MOSFETs

Cost-efficient micro-lead portfolio combines safety with enhanced design flexibility using standard footprint package solutions

Nijmegen, September 11, 2025: Nexperia today introduced its first portfolio of 40-100 V automotive MOSFETs in industry standard micro-lead packages designed for use in body control, infotainment, reverse battery protection and LED lighting applications. This launch initially features 19 devices in MLPAK33-WF as well as Nexperia’s first 40 V device in MLPAK56-WF, both incorporating wettable flanks (-WF) to enable reliable solder joint inspect and AOI, thereby providing designers with a range of MOSFETs that combine flexibility of choice, a smart cost-performance balance and the capacity to quickly ramp up high-yield production, without compromising on safety.

Vehicle architectures are evolving from ECU-based control, where each function has its own unit, to domain control, and now towards zonal architectures that consolidate applications under zonal control units. At the same time, the rise of electronics-rich vehicles and the growing integration of infotainment and smart features are prompting OEMs to rethink traditional automotive design requirements to support advanced, consumer-style applications within vehicles. This shift is driving higher MOSFET demand in DC/DC converters, inverters, and battery management systems. Operating at lower temperatures, these systems can leverage cost-effective micro-leaded devices such as Nexperia’s new MLPAK33-WF and MLPAK56-WF. Alongside their cost-performance balance, these new components meet the traditional requirements of automotive designs: AEC-Q101 qualified, robust performance, excellent board-level reliability, and side-wettable flanks supporting automated optical inspection (AOI), making them ideally suited to the evolving automotive landscape.

This new portfolio allows designers to choose from a wide selection of micro-lead MOSFETs with various RDS(on) values, offered in standardized footprints that simplify design-in and allow engineers to seamlessly migrate between MOSFET packaging, making it easy to adopt Nexperia MLPAK devices. In addition, they deliver rugged performance, excellent switching capability (low spiking and ringing) and high-power density. The high avalanche rating of these MOSFETs reduces the need to use free-wheeling diodes or bulky snubbers in switching circuits. This lowers component count and board area, thereby helping to reduce the overall system cost.

This launch marks the first of many MLPAK releases from Nexperia, reinforcing our commitment to scalable, high-performance MOSFET solutions. By uniting proven quality and reliability, with supply chain strength, Nexperia enables design engineers to deliver efficient systems with confidence.

To learn more about Nexperia’s new portfolio of automotive qualified 40-100 V MLPAK MOSFET products, visit: www.nexperia.com/mosfets