Tag: MOSFETS

Offered in the PowerPAK®  SO-8 Single Package, Devices Provide High Vth(min) > 2.5 V and Qgd / Qgs Ratios < 1 MALVERN, Pa. — July 7, 2026 — ...

Top-side cooled SMD package provides a practical route to higher power density and system efficiency while simplifying heatsink and mechanical ...

Direct-cooled thermal management offered by a reflow-compatible, isolated thermal pad significantly improves power density, reliability, and efficiency. Integrated aluminum nitride ...

Plano, Texas – March 25, 2026 – Diodes Incorporated (Diodes) (Nasdaq: DIOD) expands its PowerDI8080-5 automotive-compliant* N-channel MOSFET portfolio with the introduction of an industry-leading, ...

The BZPACK mSiC power modules leverage Microchip’s advanced mSiC technology, incorporating performance of its MB and MC SiC MOSFET families ...

Authors: Volodymyr Ilchuk, Team Lead, Application Engineering and Irena Zhuravchak, Application Engineer, Lviv, Renesas, Ukraine This article focuses on the ...

QDPAK and Low-profile TO247 in the latest GeneSiC™ 5th Generation Trench-Assisted Planar SiC MOSFET technology deliver significant improvements in performance and ...

New SuperQ™ 200V MOSFETs deliver industry-lowest RDS(on) across multiple industry-standard power packages. LEHIGH VALLEY, PA, March 2026 – iDEAL Semiconductor announces the expansion ...

Devices Offer Drop-in Replacements for Competing Solutions in Medium to High Frequency Applications MALVERN, Pa. — Jan. 28, 2026 — ...

New X4-Class device simplifies thermal design, boosts efficiency, and reduces part count in energy storage, charging, drone, and industrial applications. ...