Siemens wins Best of Show Award for “Packaging: Design” at 2026 Chiplet Summit

Siemens has won in the “Packaging: Design” category at the 2026 Chiplet Summit Best of Show Awards for its Innovator3D IC™ solution. The solution provides a fast, predictable pathfinding, planning and heterogeneous integration of ASICs and chiplets using advanced 2.5D and 3D packaging technologies.

The award was presented at the fourth annual Chiplet Summit at the Santa Clara Convention Center. Chiplet Summit, a product of Semper Technologies, is the industry’s largest chiplet show, serving the needs of technologists who use chiplets in designs for processors, memories, communications chips and AI devices.

“The recognition of Innovator3D IC at Chiplet Summit reinforces our mission to deliver cutting edges technologies that radically accelerate how our customers are developing the next generation semiconductors,” said AJ Incorvaia, senior vice president, Electronic Board Systems, Siemens Digital Industries Software. “With Innovator3D IC, we are delivering a true system-level design approach where heterogeneous dies, chiplets, interposers and packages are optimized and validated within a single unified flow.”

“Siemens’ Innovator3D IC stands out for its combination of design lifecycle coverage and breadth of industry-standard data models,” said Chuck Sobey, general chair, Chiplet Summit. “As multi-die integration grows more complex, this solution gives designers the tools to move faster and innovate with confidence. We congratulate Siemens EDA on this well-deserved recognition.”

To learn more about Innovator3D IC and how it delivers a fast, predictable path for the planning and heterogeneous integration of ASICs and chiplets using the latest and most advanced semiconductor packaging 2.5D & 3D technologies and substrates, visit https://www.siemens.com/en-us/products/ic-packaging/innovator3d-ic/

For details of all of the winners, go to https://chipletsummit.com/2026-best-of-show-awards/