Chicony Power and TI join forces to bring GaN technology to next-generation energy-efficient laptop power adapter
Chicony Power achieved high power density and up to 94% efficiency in their latest laptop power adapter design backed by...
Chicony Power achieved high power density and up to 94% efficiency in their latest laptop power adapter design backed by...
French public R&I organisation to use CGD’s GaN HEMTs in innovative, next-gen automotive inverter design 13.12.22 Cambridge, UK - Cambridge...
Sivers Semiconductors AB (“Sivers”) today announces that its business unit, Sivers Wireless, has signed an $320k (MSEK 3.3) agreement to...
These latest models support the NS family of standard processors in safety-critical and next-generation embedded systems, for developers using Imperas...
ImperasDV is based on the trusted Imperas reference models and Verification IP, combined with architectural validation test suites and coverage...
Dec 2022: Unique, Z-axis compression CIN::APSE interconnects from Cinch providing superior mechanical and electrical performance under the most extreme mechanical...
El Dorado Hills, CA, December 8, 2022 —Aetina, an edge AI solution provider that offers embedded computing hardware and software...
El Dorado Hills, CA, December 8, 2022 —Aetina, an edge AI solution provider that offers embedded computing hardware and software...
Plano, Texas – December 8, 2022- Diodes Incorporated (Diodes) (Nasdaq: DIOD) is targeting growing opportunities in USB Type-C® technology, and...
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