• Home
  • About Us
  • Contact Us
Semiconductor for You
  • Home
  • Semiconductor News
  • Technology
    • Automotive
    • Consumer Electronics
    • IoT
    • Lighting
    • Power Management
    • Wireless
    • Personal Electronics
    • Hardware & Software
    • Research
    • Medical Electronics
    • Embedded Design
    • Aerospace & Defence
    • Artificial Intelligence
  • DIY Projects
  • Market
  • Industries
    • Renesas Electronics
  • Knowledge Base
  • Events
  • Tools
    • Resistor Color Code Calculator
No Result
View All Result
  • Home
  • Semiconductor News
  • Technology
    • Automotive
    • Consumer Electronics
    • IoT
    • Lighting
    • Power Management
    • Wireless
    • Personal Electronics
    • Hardware & Software
    • Research
    • Medical Electronics
    • Embedded Design
    • Aerospace & Defence
    • Artificial Intelligence
  • DIY Projects
  • Market
  • Industries
    • Renesas Electronics
  • Knowledge Base
  • Events
  • Tools
    • Resistor Color Code Calculator
No Result
View All Result
Semiconductor for You
No Result
View All Result
Home Semiconductor News

Highly reliable Z-axis compression CIN::APSE connectors from Cinch

Semiconductor For You by Semiconductor For You
December 9, 2022
in Semiconductor News
0
ADVERTISEMENT

Dec 2022: Unique, Z-axis compression CIN::APSE interconnects from Cinch providing superior mechanical and electrical performance under the most extreme mechanical shock and vibration conditions, can now be ordered through Powell Electronics, the supplier of connectors and more for high-rel applications including defence, aerospace and industrial. The high-density Cinch CIN::APSE custom connectors are the most widely implemented crimpless and solderless, high-speed interconnects in the industry and enable a quick installation.

Cinch CIN::APSE custom interconnects have been designed for board to board, IC to board, flex to board and component to board connections in high-speed digital, flex circuit and PCB applications. A wide range of profiles from 0.020” up to 1.0” and 0.5mm up to 1.0mm diameter contacts with a standard pitch of 1.0 mm or greater is available. The number of contacts is not limited and the largest connector implemented to date contained 7,396 I/Os.

The patent protected design uses liquid crystal polymer insulators and bundled gold-plated molybdenum wire contacts and enables 50+ Gbps. Solderless termination is achieved through compression and the unique contact design assures multiple points of contact per I/O. Gold plated copper spacers are used for long Z-axis connectors.

For further information please visit: https://www.powell.com/content/Cinch-Connectivity-3100042558

Content Protection by DMCA.com
Tags: connectors
Semiconductor For You

Semiconductor For You

Browse by Category

  • Aerospace and Defence
  • Articles
  • Automotive
  • Consumer-Electronics
  • Hardware & Software
  • Interview
  • IoT
  • Knowledge Base
  • Lighting
  • Market
  • personal-electronics
  • Power Management
  • Research
  • Semiconductor Events
  • Semiconductor News
  • Technology
  • Wireless
Semiconductor for You

Semiconductor For You is a resource hub for electronics engineers and industrialist. With its blend of
technology features, news and new product information, Semiconductor For You keeps designers and
managers up to date with the fastest moving industry in the world.

Follow Us

Browse by Category

  • Aerospace and Defence
  • Articles
  • Automotive
  • Consumer-Electronics
  • Hardware & Software
  • Interview
  • IoT
  • Knowledge Base
  • Lighting
  • Market
  • personal-electronics
  • Power Management
  • Research
  • Semiconductor Events
  • Semiconductor News
  • Technology
  • Wireless

Recent News

TDK expands thin-film power inductors for automotive applications to higher currents

TDK expands thin-film power inductors for automotive applications to higher currents

July 2, 2025
Renesas Strengthens Power Leadership with New GaN FETs for High-Density Power Conversion in AI Data Centers, Industrial and Charging Systems

Renesas Strengthens Power Leadership with New GaN FETs for High-Density Power Conversion in AI Data Centers, Industrial and Charging Systems

July 2, 2025
  • About
  • Advertise
  • Privacy & Policy
  • Contact

© 2022 Semiconductor For You

No Result
View All Result
  • Home
  • Semiconductor News
  • Technology
    • IoT
    • Wireless
    • Power Management
    • Automotive
    • Hardware & Software
  • Market
  • Knowledge Base
  • Tools
    • Resistor Color Code Calculator

© 2022 Semiconductor For You