SEGGER introduces emCompress-PRO software
Monheim am Rhein, Germany – June 6st, 2022 emCompress-PRO, a new all-in-one compression software from SEGGER, comes with all industry...
New processors make edge AI more accessible while cutting power consumption in half
Engineers can meet form-factor requirements and deploy smart designs anywhere with power-efficient processors Bangalore, India (June 3, 2022) – Expanding...
Renesas Introduces Complex Device Driver Software to Ease Development of Battery Management Systems for Electric Vehicles
New Software Complements Renesas Leading Li-Ion Battery Manager IC to Enable ASIL D-Compliant Designs TOKYO, Japan, June 02, 2022 ―...
ENPOWER first to adopt Infineon’s latest 750 V automotive-grade discrete IGBT EDT2 devices
Munich, Germany – 1 June, 2022 – Zhuhai ENPOWER Electric Co., Ltd. (ENPOWER), a China based leading supplier of inverters...
Renesas Unveils Industry’s First I3C Intelligent Switch Family for Next Generation Server, Storage and Communications Systems
Innovative Devices Enable Control Bus Scaling in Chassis- and Rack-Based Systems While Simplifying Overall Design TOKYO, Japan, May 31, 2022...
Infineon introduces new high-performance XENSIV™ MEMS microphones with outstanding audio capturing for consumer electronics
Munich, Germany – 31 May, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching its next-generation XENSIV™...
Infineon and pmdtechnologies develop 3D depth-sensing technology for Magic Leap 2
Munich, Germany – 30 May 2022 – Augmented reality (AR) applications are about to fundamentally change the way we live...
Infineon’s AIROC™ Wi-Fi/Bluetooth® solutions now available with NVIDIA Jetson Edge AI platform
Munich, Germany – 27 May, 2022 – Artificial intelligence (AI) at the edge will tremendously impact a number of industry...
MediaTek Announces World’s First Complete Wi-Fi 7 Platforms for Access Points and Clients
Filogic 880 and Filogic 380 will drive the next generation of connectivity with the fastest and most reliable Wi-Fi 7...
MediaTek Launches First mmWave Chipset for Seamless 5G Smartphone Connectivity
Dimensity 1050 mmWave SoC highlights trio of new chipsets expanding MediaTek’s 5G and gaming portfolio HSINCHU, Taiwan – May 23,...
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