Infineon’s XENSIV™ PAS CO2 meets the performance criteria of internationally recognized WELL and LEED green building standards
Munich, Germany – 20 June, 2023 – As part of the global effort for decarbonization, improving the energy efficiency of...
OMNIVISION Adds Two New Products to Its Broad Family of Global Shutter Sensors for Automotive In-Cabin Applications
The new OX02C1S and OX01H1B sensors feature a small 2.2-micron pixel with world-leading QE, MTF and low power for driver...
MosChip Announces the appointment of Semiconductor Industry Veteran Dr. Naveed Ahmed Sherwani to the Board of Directors
Santa Clara, CA, - June 19, 2023 - MosChip Technologies, a semiconductor and system design servicescompany, announced that Dr. Naveed...
SEGGER adds Stack Overflow Prevention (STOP) technology to Embedded Studio for ARM
Monheim am Rhein, Germany – June 16th, 2023 The latest release of SEGGER's Embedded Studio for ARM comes with STOP...
Renesas Updates Progress One Year After Reality AI Acquisition
Several New AI Solutions Spanning Industrial, HVAC and Automotive Applications Will be Showcased at Sensors Converge Tradeshow June 20-22 in...
X-FAB Leads EU-funded Consortium to Industrialize the European Silicon Photonics Value Chain
PhotonixFAB to enable photonics product innovation and commercialization with a path to high-volume manufacturing Tessenderlo, Belgium – June 14, 2023...
Wireless mesh networking leader, NeoCortec expands into new facilities
Manufacturer of ultra-low-power bi-directional wireless mesh network modules doubles size of HQ Copenhagen – June 13, 2023 – NeoCortec, manufacturer...
Next generation 1200 V CoolSiC™ Trench MOSFET in TO263-7 package boosts e-Mobility
Munich, Germany – 13 June, 2023 – Infineon presents its new generation of 1200 V CoolSiC™ MOSFETs in TO263-7 for...
Analog Devices Announces Apollo MxFE Advanced Software-Defined Signal Processing Solution
Analog Devices Announces Apollo MxFE Advanced Software-Defined Signal Processing Solution for Aerospace & Defense, Instrumentation, and Next-Generation Wireless Communications India,...
Infineon releases ModusToolbox™ 3.1 to accelerate embedded development
Munich, Germany – 12 June, 2023 – As software becomes a critical feature in the variety of embedded solutions in...
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