New Matter Solution from Silicon Labs Unifies the IoT Connectivity Experience
Ecosystem milestone delivers open-source technology that simplifies IoT development AUSTIN, Texas – May 12, 2021 Silicon Labs (NASDAQ: SLAB), a...
Lattice Automate Solution Stack Accelerates Development ofIndustrial Automation Systems
New Stack Provides Low Power, Secure, and Reliable Solutions for Next-Generation Factory Automation and Industrial Robotics HILLSBORO, OR – May...
New i.MX8M Mini solder-down SoM from Direct Insight combines high performance, miniaturization and low cost
Low power, multi-featured module enables PCIe access Oxfordshire, UK May 2021: Direct Insight, the UK-based, technical systems integrator and reseller...
ADLINK Releases Industry-first Embedded MXM Graphics Modules on NVIDIA Turing™ Architecture
Embedded MXM graphics modules based on Turing architecture for edge AI Summary: ADLINK EGX-MXM-T1000, EGX-MXM-RTX3000 and EGX-MXM-RTX5000 are the first...
Infineon launches industry’s highest density QML-V-certified QDR-II+ SRAM to simplify on-system satellite image processing
Munich, Germany – 10 May 2021 – Infineon Technologies LLC, an Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) company,...
Power MOSFETs
In general, power MOSFETs employ thicker oxides, deeper junctions and have longer channel lengths. These generally post a penalty on...
We design and build highly efficient and power electronics for all voltage and power levels
Ali Husain is Senior Manager for Strategy and Corporate Marketing, focusing on power electronics. He has previously worked in Technical...
Cellular IoT Discovery Kit
May 10, 2021: The STMicroelectronics B-L462E-CELL1 Discovery kit brings together the critical hardware and software building blocks, including GSMA-certified embedded...
IBM Unveils World’s First 2 Nanometer Chip Technology
New chip milestone to propel major leaps forward in performance and energy efficiency ALBANY, N.Y., May 6, 2021 /PRNewswire/ --...
Navitas Semiconductor, the Industry Leader in Gallium Nitride (GaN) Power ICs, to Go Public at an Enterprise Value of $1.04 Billion via Live Oak II SPAC Business Combination
Deal raises approximately $400M capital, including an over-subscribed and upsized $145M PIPE. Capital to be used for accelerated product development...
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