X-FAB Expands its 180nm BCD-on-SOI Technology Platform for Automotive
Cross-sectional SEM image of a new high-voltage NMOS device Tessenderlo, Belgium – July 11, 2019 X-FAB Silicon Foundries SE, the...
UTAC receives a top supplier award from Analog Devices, Inc.
Global semiconductor test and assembly services provider recognised for outstanding support for ADI/ LTC integration Singapore, 09 July 2019 –...
TE Connectivity Begins Acquisition of First Sensor AG
TE Connectivitycommences public takeover offer for First SensorAG Acceptance period to expire on September 2, 2019 SCHAFFHAUSEN, Switzerland –July 8,...
Maxim Enhances MediaTek’s AUTUS in-vehicle infotainment (IVI) platform
Maxim’s GMSL SerDes technology extends video transmissions to 15 meters for surround-view applications MUNICH, Germany – July 8, 2019 – Maxim Integrated...
NEC to Provide Face Recognition for Six Major Airports in Japan
TOKYO, July 10, 2019 - NEC Corporation (TSE: 6701) has announced an order from Japan Customs, under the Ministry of...
Würth Elektronik presents WL-SMCC LED series
Super Compact, Super Intensive Waldenburg (Germany), 10 July 2019 – Würth Elektronik has expanded its LED portfolio with a particularly compact...
“CAN Bus IMU for Autonomous Car Safety” Whitepaper
How CAN bus connected IMUs Improve Safety & Navigation Accuracy for Autonomous Cars, Construction and Heavy Machinery Andover, Massachusetts- July...
Trackwise announces new Vertical Continuous Plating capability
State-of-the-art manufacturing process brings Industry 4.0 levels of quality, flexibility and cost to Trackwise’s customers Tewkesbury, UK: Trackwise continues to...
XP Power introduces new, informative medical power supplies guide
July 3, 2019 – XP Power, a leading global supplier of power solutions, has introduced a new medical power supplies...
Low-power Chips for AI Applications
FranckV .on Unsplash EU project TEMPO targets low-power chips for AI applications based on emerging memory technologies This week, Fraunhofer...
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