The ZED-F9K GNSS and dead reckoning module improves positioning performance tenfold over standard precision technology. Thalwil, Switzerland – May 2,...

WAKEFIELD, Mass. -- May 1, 2019 -- Laird Performance Materials has developed a hybrid thermal & EMI absorber material that...

700 Volt (V) MOSFETs and 700 V and 1200 V Schottky Barrier Diodes (SBDs) extend customer options as demand grows...

TT Electronics launches first-of-its-kind High Energy Double Sided Chip resistor, for maximum surge performance in a compact space Better surge...

HiTemp ET Series thermoelectric modules from Laird Thermal Systems simplify cooling in high heat applications... April 30, 2019 – Laird...

RC Series Prevents Arcing and Noise in Relay and Switch Contacts while Delivering High ‘Voltage Withstand Strength’ NORTHVALE, New Jersey,...

Positive and negative, memory sales continue to strongly impact total IC market. IC Insights recently updated its 2019-2023 semiconductor market forecasts in its March Update to...

Booth will feature hybrid IGBT device for rugged power applications and range of IGBT drivers that offer best-in-class current performance...

Digi AnywhereUSB Plus brings secure, flexible, and scalable USB 3.1 multiport connectivity at Gigabit speeds and beyond for USB devices...

Offered in Small Sizes, Components Save Space, Lower Assembly Costs, and Increase Reliability MALVERN, Pa. — April 29, 2019 —...