By Mustaqh Ali Shaik, Marketing Manager at MosChip & Core Committee, IESA AI Summit 2023 In today's rapidly evolving technological...

- Beam steering achieved by integrating antenna elements and phase shifters - TOKYO, Oct 12, 2023 -  NEC Corporation (TSE:...

95 mm x 70 mm Form Factor COM specification brings low power and high-performance interfaces to drones, mobile robots, and...

Expanding industry's most efficient Bluetooth LE portfolio New groundbreaking nRF54L Series succeeds Nordic Semiconductor’s market-leading nRF52 Series, setting a new...

Munich, October 12, 2023 - As a leading global semiconductor manufacturer for power systems and IoT, Infineon Technologies AG (FSE:...

Strategic Collaboration Will Accelerate Unification of Developer Experience Across Renesas' Wide Embedded Processing Portfolio; Offers Support for Heterogeneous Architectures TOKYO,...

From PSU specification to PCB layout in minutes using PI Expert and SnapMagic San Jose and San Francisco, Calif. –...

Monheim am Rhein, Germany – October 4th, 2023 SEGGER's J-Link PRO PoE, a new member of the J-Link family, with...

Joint collaboration on SiC modules brings the next step in module compactness and maximum power density Nijmegen, October 4, 2023:...

Double space saving with integrated BJTs and resistors in ultra compact DFN2020(D)-6 packaging Nijmegen, September 27, 2023: Nexperia, the essential...