Messe Muenchen India and dmg events Announce Partnership to Launch AiX DataWorld 2027
The new conference and exhibition will support the developers, operators and technology providers building the data centre infrastructure required for...
Ambarella and Macnica Enter a Long-Term Strategic Distribution Agreement to Accelerate Edge AI Infrastructure and Physical AI Adoption
Partnership expands Ambarella’s go-to-market reach through Macnica’s distribution, technical enablement and ecosystem development capabilities across the Americas and EMEA, driving significant...
Experience Melexis’ unique robotics and mobility solutions at electronica 2026
Tessenderlo-Ham, Belgium, 3 September 2026 – Melexis will bring an extensive range of advanced sensing, protection, and driver technologies to...
Ambarella Engages Capgemini to Help Accelerate Enterprise Adoption of Edge and Physical AI
Capgemini to provide engineering, integration, and industry expertise to support Ambarella's next phase of growth SANTA CLARA, Calif. and NEW...
Infineon and Skeleton collaborate on solid-state transformers and sidecars for AI power to enhance AI data center resilience
Munich, Germany – 2 September 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Skeleton Technologies, a global...
LITEON Announces Strategic Investment in Liquid Cooling Technology Company DCX
Advancing AI Infrastructure Value Chain Through Integrated Power Management and Cooling Technologies 2026/09/03 Taipei — LITEON Technology (2301.TW) today announced a strategic...
Infineon’s SECORA™ Wallet brings secured NFC payments to mPTech’s Hammer smartwatch
Munich, Germany – 3 September 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and mPTech are strengthening their...
Indium Corporation to Highlight High-Reliability Solder, Low-Silver, and Thermal Management Solutions at Productronica India
CLINTON, N.Y., September 1, 2026 — With a team of manufacturing and technical experts supporting customers across India, Indium Corporation will...
Rohde & Schwarz has achieved initial verification of 3GPP Rel. 17 power-saving feature SSSG for 5G NR
Rohde & Schwarz in collaboration with Qualcomm Technologies, Inc. has completed an early verification step for 3GPP Rel. 17 Search...
Everspin Technologies and Teledyne HiRel Semiconductors Partner to Accelerate MRAM Adoption in Aerospace and Defense Applications
New partnership will bring Everspin 256Mb PERSYST MRAM into Teledyne HiRel Semiconductors’ memory solutions for mission-critical systems CHANDLER, Ariz., and...
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