Matter 1.5 enhances the consumer experience at home with right-first-time NFC onboarding of multiple devices as fast and easy as...

Growth Driven by Robust Investments in Leading-Edge Logic, DRAM, and Packaging Technologies to Support AI Wave   MILPITAS, Calif. – December 2, 2025 – SEMI, the industry association...

National security must always come first. We fully support the Government’s continued efforts to strengthen the safety, integrity and resilience...

For Medium to High Frequency Applications, Low Profile Devices Save Space While Reducing Parasitic Inductance for Cleaner Switching MALVERN, Pa....

News Highlights HPE will be one of the first OEMs to adopt the AMD “Helios” architecture, an open, full-stack AI...

The annual DigiWish contest returns Dec. 1-24, giving engineers, makers and tech enthusiasts a chance to win daily prizes and...

Suchi Semicon has introduced two new semiconductor packaging product lines, QFN Packages and Power Packages, to expand its advanced packaging...

TDK presents new S series inrush current limiters for up to 35 A and 750 J in high-power applications TDK...

Join DigiKey and Hirose for an Informational Webinar on Humanoid Robotics Explore the challenges and solutions in humanoid robotics, from...

December 2, 2025 – Taipei – The wave of innovation driven by generative AI is sweeping the globe, and AI's capabilities...