Nexperia brings the benefits of clip-bonded FlatPower packaging to bipolar junction transistors
CFP15B package offers a compact and cost-efficient alternative to MJD series in DPAK package Nijmegen, July 16, 2025: Nexperia today...
CFP15B package offers a compact and cost-efficient alternative to MJD series in DPAK package Nijmegen, July 16, 2025: Nexperia today...
TDK has unveiled the latest TDK SensEI product line, edgeRX Vision, an ultra-fast, AI-powered defect detection system that analyzes customer...
Analog industry veteran to succeed longtime leader Balu Balakrishnan SAN JOSÉ, CALIF. – July 15, 2025 – Power Integrations (Nasdaq: POWI), the...
· Microelectronics UK exhibition to open at Excel London on 24-25 September 2025 with keynote speech from UK government innovation...
This project presents a hybrid surveillance system that combines a two-wheel drive (2WD) land vehicle with a quadcopter drone for...
Event to Showcase Global Semiconductor Trends and India's Local Ecosystem Development National, July, 2025: Visitor registration for SEMICON India 2025, scheduled to...
QFN-style 29mm2 SoM offers dual ARM Cortex-A35, NPU, VPU, GPU & PCIe to combine intelligent edge processing with high-end multimedia...
Enable high efficiency power conversion in energy-intensive AI server farms Nijmegen, July 10, 2025: Nexperia today announced the addition of two...
New Devices from MCU Leader Meet Demands for Performance and Compact Size; Offer Peripheral Set Targeted for Motor Control TOKYO,...
Munich, Germany – 9 July 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is expanding its offering for...
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