Communication modules are becoming secure connectivity platforms for the software-defined era

As wireless connectivity becomes central to automotive, industrial IoT, and smart infrastructure, Vaishali Umredkar, Editor of Semiconductor For You speaks with Takeshi Hashimoto, Managing Director, Murata Electronics (India) Private Limited on how Murata Electronics is advancing module innovation through miniaturization, multi-protocol integration, and reliability-driven design to meet next-generation communication demands across India’s fast-evolving electronics ecosystem.

Murata has evolved from discrete RF components to complete communication modules—what market needs drove this shift?

As applications have diversified and performance requirements have become more sophisticated, wireless functionality is increasingly expected to be delivered not as individual components, but as fully validated systems that work reliably.

Market demands for shorter development cycles, reduced certification burdens, and optimized coexistence among multiple wireless standards have accelerated the shift from discrete components to module-based solutions.

How does Murata manage extreme miniaturization while maintaining performance and reliability in wireless communication modules?

We reduce component volume through material and process miniaturization, while addressing noise, thermal, and coexistence challenges through high-density RF front-end integration and optimized shielding structures. By leveraging advanced simulation technologies, we are able to achieve both compact size and high reliability simultaneously.

With multiple wireless standards coexisting, how does Murata decide which technologies to prioritize in its product roadmap?

We determine priority technologies by aligning market needs with our technical strengths, evaluating application suitability, regulatory requirements, ecosystem maturity, and manufacturability. In addition, we continuously analyze standardization trends and carefully select technologies by accurately assessing and marketing the wireless capabilities required in each target market.

How does Murata’s deep RF expertise translate into system-level advantages for IoT and connected devices?

Because we offer everything from RF front-end modules and acoustic wave devices to antenna interference mitigation components in-house, we can optimize circuit design, enclosure design, and coexistence performance in an integrated manner. This enables us to simultaneously achieve miniaturization, sensitivity, EMC performance, and production reproducibility—creating true system-level advantages.

In dense IoT environments, how does Murata ensure stable, interference-free communication?

In dense environments, the goal is not to eliminate interference entirely, but to ensure stable operation under interference conditions. By combining standard- level frequency control, hardware-level interference suppression design, and system-level channel optimization, we enhance overall communication quality in a comprehensive manner.

For safety-critical applications like automotive and healthcare, what differentiates Murata’s communication solutions?

In automotive applications, we support stringent qualification standards and ensure stable performance under high-temperature and high-frequency conditions, contributing to robust connectivity in the V2X and 5G era. In medical applications, we operate under ISO 13485-compliant manufacturing systems and implement 100% inspection to minimize initial failures, achieving quality levels suitable even for life-related applications. Our differentiation lies in a design and manufacturing foundation that can demonstrate long-term reliability.

How important is interoperability and multi-protocol support in Murata’s communication product strategy today?

As connected device applications expand, interoperability becomes a prerequisite for adoption. While multi-protocol capabilities are often driven by semiconductor vendor roadmaps, we strategically select and integrate those technologies into module solutions that best fit specific market needs. By integrating Wi-Fi, Bluetooth, Thread, and other technologies—and enabling connectivity to higher- level ecosystems such as Matter—we reduce customers’ development complexity and deployment costs. Multi-protocol support is therefore critically important in our current strategy.

How is Murata preparing its communication technologies for higher data rates, lower latency, and increased device density?

To address high-throughput technologies such as Wi-Fi 7 and low-latency, high- reliability cellular communications, we are advancing multi-band designs, high- density integration, thermal management, and certification readiness ahead of demand. Rather than simply following standards, we design modules with mass production and quality assurance in mind to prepare for future requirements.

How does Murata see demand evolving in India for wireless modules across automotive, industrial, and smart infrastructure applications?

In India, demand for connectivity in automotive electronics, infrastructure monitoring, and industrial IoT is expanding, driven by electrification, smart city initiatives, and industrial modernization policies. We expect the importance of highly reliable, long-range, and low-power wireless modules to continue increasing in this market.

Especially, Murata sees significant growth in Connectivity modules for the 2W and 4W Automotive applications with support for long-range, low-power industrial IoT and edge-AI systems as India modernizes agriculture, factories, and environmental monitoring.

As connectivity becomes central to software-defined systems, how does Murata see the role of communication modules changing over the next decade?

With the advancement of software-defined architectures, communication modules will evolve from simple wireless components into connectivity platforms that incorporate OTA updates and security functions. In SDV and advanced IoT environments in particular, they will serve as secure connectivity foundations with certifiable reliability and full traceability.