EVG wafer bonding chambers surpass 1100 installed worldwide

EV Group of St Florian, Austria – a supplier of wafer bonding and lithography equipment for semiconductor, micro-electro-mechanical systems (MEMS) and nanotechnology applications – says that more than 1100 EVG wafer bonding chambers have now been installed at customer facilities worldwide to date.

The EVG500, EVG850, GEMINI and ComBond series of wafer bonding solutions, in particular, are seeing strong demand due to their performance and cross-platform compatibility, which allows users to more easily ramp up their R&D processes to high-volume manufacturing, says EVG.

“Our product offerings span the entire manufacturing chain from R&D and small-scale production environments to full-scale, high-volume production,” says Hermann Waltl, executive sales & customer support director. “This enables us to support our customers throughout as they transform new ideas into real-world products.”

For adhesive, solder and eutectic bonding, the EVG500 series of semi-automated wafer bonders and GEMINI series of fully automated wafer bonders support non-hermetic, cost-efficient encapsulation of CMOS image sensors, surface acoustic wave (SAW) filters for wireless RF chips, and other devices for mobile phones and other high-volume consumer applications. Additionally, tool configurations can be tailored to more demanding bond processes such as hermetic encapsulation for MEMS devices.

For high-vacuum encapsulation bonding, the new EVG ComBond automated high-vacuum wafer bonder provides ultra-high-vacuum encapsulation (10-8mbar) needed for next-generation MEMS devices, such as gyroscopes, microbolometers, and advanced sensors used in autonomous cars, virtual reality headsets and other applications.

For fusion bonding, the EVG850LT and the GEMINI FB automated fusion bonders enable manufacturing of high-accuracy optical devices, image sensors, and engineered substrates such as silicon-on-insulator (SOI), silicon carbide (SiC) and gallium nitride (GaN) for RF, power and other high-speed/high-efficiency devices.

“EVG is continuously improving our process solutions in order to address wider market applications and more stringent industry requirements,” says Waltl. “This has paid off for our customers, which in turn has enabled us to maintain our leadership position in the wafer bonding market,” he adds.