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Monheim am Rhein, Germany – 21st January 2021 SEGGER's J-Link on-board debug probes can be found on hundreds of different...

Lattice Announces Training Center for Award-Winning FPGAs and Solution Stacks

Created in Partnership with Leading European FPGA Consulting Firm, Lattice Education Competence Center to Focus Exclusively on Lattice Technologies HILLSBORO,...

High power density, 10:1 ratio DC-DC converters in half- and quarter-brick footprint from Murata

Hoofddorp, Netherlands: Murata announces two new ultra-wide 10:1 ratio DC-DC converters, the 250W IRH-W80 half-brick and the 150W IRQ-W80 quarter-brick...

ADLINK Introduces a Portable PXI Express Chassis with Fast, Versatile Thunderbolt™ 3 Interfaces

The compact and affordable PXES-2314T test and measurement platform eliminates need to trade-off cost, convenience or performance Summary: ● ADLINK’s...

Renesas Introduces Innovative New “Lab on the Cloud” Environment

Designers Can Configure Evaluation Boards Remotely Through an Intuitive GUI TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier...

STMicroelectronics Boosts IoT Design with miniature STM32 MCU

June 3, 2021

Offloads complete RF design for faster time to market Assures optimized wireless performance, low power, compact footprint Bluetooth ® LE,...

MediaTek Launches 6nm Dimensity 1200 Premium 5G SoC

June 5, 2021

MediaTek also announces Dimensity 1100 5G chipset to give device makers even more design flexibility HSINCHU, Taiwan – Jan. 20,...

Rutronik UK stocks Eaton cylindrical hybrid supercapacitors with eight times higher energy density

May 27, 2021

Manchester, UK – 20 January 2021 – The new HS/ HSL Hybrid Supercapacitors from Eaton provide a power density that...

Würth Elektronik extends its product family of WE-KI ceramic SMT inductors

June 28, 2021