u-blox ALEX-R5 integrates cellular and GNSS technology into a miniature SiP form factor with zero compromises
The SiP features the secure u-blox UBX-R5 LTE-M / NB-IoT chipset and the u-blox M8 GNSS chip for size-constrained asset...
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XP Power announces Pan-European distribution agreement with Distrelec
January 26th, 2021 – XP Power has signed a Pan-European distribution agreement with Distrelec. The new partnership will allow the...
24 V dual-channel low side EiceDRIVER™ with enable function and integrated thermal pad
Munich, Germany – 25. January 2021 – Infineon Technologies AG (FSE: IFX / QTCQX: IFNNY) broadens its EiceDRIVER™ portfolio with...
SEGGER’s J-Link OB plays crucial role in new BBC ‘HiFive Inventor’ educational kit
Monheim am Rhein, Germany – 21st January 2021 SEGGER's J-Link on-board debug probes can be found on hundreds of different...
Lattice Announces Training Center for Award-Winning FPGAs and Solution Stacks
Created in Partnership with Leading European FPGA Consulting Firm, Lattice Education Competence Center to Focus Exclusively on Lattice Technologies HILLSBORO,...
High power density, 10:1 ratio DC-DC converters in half- and quarter-brick footprint from Murata
Hoofddorp, Netherlands: Murata announces two new ultra-wide 10:1 ratio DC-DC converters, the 250W IRH-W80 half-brick and the 150W IRQ-W80 quarter-brick...
ADLINK Introduces a Portable PXI Express Chassis with Fast, Versatile Thunderbolt™ 3 Interfaces
The compact and affordable PXES-2314T test and measurement platform eliminates need to trade-off cost, convenience or performance Summary: ● ADLINK’s...
Renesas Introduces Innovative New “Lab on the Cloud” Environment
Designers Can Configure Evaluation Boards Remotely Through an Intuitive GUI TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier...
STMicroelectronics Boosts IoT Design with miniature STM32 MCU
Offloads complete RF design for faster time to market Assures optimized wireless performance, low power, compact footprint Bluetooth ® LE,...
MediaTek Launches 6nm Dimensity 1200 Premium 5G SoC
MediaTek also announces Dimensity 1100 5G chipset to give device makers even more design flexibility HSINCHU, Taiwan – Jan. 20,...
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