Eliminate noise issues in tightly stacked designs with Pickering’s new electrostatic shielding option
New screening option for Pickering’s Series 67/68 10kV high voltage reed relays minimize noise between the coil drive and high...
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Infineon fosters the adoption of its innovative multilevel Class D audio amplifier technology through an ecosystem of associated partners
Munich, Germany – 17 January, 2023 – Long-lasting music playback performance that comes in compact, cost-effective, and power-efficient designs, is...
Precise positioning Click board from MIKROE enables centimetre-level accuracy
Embedded solutions company passes 1300 Click boards released January 2023: MikroElektronika (MIKROE), the embedded solutions company that dramatically cuts development...
Renesas Introduces Low-Power RL78/G15 MCU with the Smallest 8-pin Package Option Available within the RL78 Family
Lower-pin Package Device Further Expands the RL78 Family with More Device Selection TOKYO, Japan, January 12, 2023 ― Renesas Electronics...
Infineon and Resonac announce the expansion of their cooperation and a new multi-year agreement for delivery of silicon carbide (SiC) materials
Munich, Germany – 12 January 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is extending its cooperation with...
Infineon highlights smart semiconductor solutions for a health-conscious lifestyle
Munich, Germany – 11 January, 2023 – Smart devices not only make life easier and more convenient, they also help...
GAIA Converter’s New Website Simplifies Power Design for Military Grade and High-Reliability Applications
Bordeaux, France, 11th January 2023 - GAIA Converter, a leading manufacturer of high-reliability power architectures, has launched a new user-friendly...
Infineon Technologies increases focus and investment into core semiconductor development for high-reliability markets; sells HiRel DC-DC converter business to Micross
Munich, Germany and San Jose, California – 10 January, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today...
Infinitesima to commercialise powerful new methods for semiconductor device characterisation
The addition of the tomographic capability builds on the RPM technology that has already broken new ground in taking AFM...
OKdo & OStream Unveil New Partnership at CES for Scalable, Edge AI Media Processing
Edge Supercomputer Delegates AI, Video & CPU Operations to Hardware Accelerated Components Across a Cluster of SBCs. London, UK, 6th...
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