Renesas Cellular-to-Cloud Development Kits Now Connect Seamlessly to Microsoft Azure Cloud Services
Azure-Certified Kits Featuring both RA and RX Families of 32-bit MCUs Enable Reliable and Secure End-to-End Cloud Solutions TOKYO, Japan,...
Latest News
Superior to older manufacturing methods Silanna UV Presents High Power 235nm far UVC LEDs Using New SPSL Technology
ICULTA Berlin UV LED conference to see high power at short wavelengths and exceptional lifetime Brisbane, Australia, 6 April 2023...
Wise-integration & Powernet Team Up to Deliver Digitally Controlled, Compact, Energy-Efficient GaN Power Supply Systems
Combined Technology Is Industry’s First Solution Designed to Replace Analog Controls In GaN Power Supplies, Could Introduce ‘New Era’ in...
u-blox and Position Partners roll out PointPerfect GNSS augmentation service to Australia
Thalwil, Switzerland – April 5, 2023 – u-blox (SIX:UBXN), a global provider of leading positioning and wireless communication technology and...
Renesas Is First to Support Public Building Air Quality Standards in Environmental Sensors
Firmware-Configurable Sensors Can Also Meet EPA and UBA Standards TOKYO, Japan, April 4, 2023 ― Renesas Electronics Corporation (TSE: 6723),...
CML Microcircuits launch the CMX90B701/702 low current mmWave gain blocks
The new additions to the SµRF product family are the latest to leverage the CML Microcircuits innovative RFIC/MMIC design capability,...
Industrial-Grade Silicon Carbide MOSFET from Diodes Incorporated Enables Higher Power Density
Plano, Texas – March 30, 2023 – Diodes Incorporated (Diodes) (Nasdaq: DIOD) introduces the latest addition to its portfolio of...
Infineon streamlines its decarbonization profile
Munich, Germany – 3 April 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has changed the name of...
SEGGER’s Ozone now available for macOS on the M1/M2 (ARM-core) by popular demand
Monheim am Rhein, Germany – March 27th, 2023 SEGGER announces that its debugger and performance analyzer, Ozone, is now available...
Infineon AIROC™ CYW20829 Bluetooth LE SoC ready with latest Bluetooth 5.4 specification
Munich, Germany – 23 March, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced its AIROC™ CYW20829...
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