Offloads complete RF design for faster time to market Assures optimized wireless performance, low power, compact footprint Bluetooth ® LE,...

MediaTek also announces Dimensity 1100 5G chipset to give device makers even more design flexibility HSINCHU, Taiwan – Jan. 20,...

Manchester, UK – 20 January 2021 – The new HS/ HSL Hybrid Supercapacitors from Eaton provide a power density that...

Waldenburg (Germany), 20 January 2021—Würth Elektronik has expanded its WE-KI product family with further ceramic inductor variants in 0603 and...

Microlight3D, a specialty manufacturer of high-resolution micro-scale 2D & 3D printing systems for industrial and scientific applications, has produced the...

New RF Devices, Including Industry’s-First Quad-Channel TX VGA, Deliver Wide Frequency Range and Improved Isolation in a Smaller Package January...

Qualcomm Technologies, Inc. unveiled the Qualcomm® Snapdragon™ 870 5G Mobile Platform, a follow-on to the flagship Snapdragon 865 Plus, which...

The software solution features the Quuppa Intelligent Locating System™ for asset tracking and monitoring applications PHOENIX, Ariz. – Jan. 19,...

Industry and communication network. INDUSTRY 4.0 Waldenburg (Germany), 18 January 2021 – The new IQRB-4 bridges the gap between the...

New Entry-Level MPUs Enhances Scalability of RZ/G2 Lineup January 19, 2021: TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier...