Munich, Germany – 18 January 2021 – The acquisition of Cypress positions Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY)...

LAKE OSWEGO, Ore. — February 16, 2021 — CUI Devices’ Sensors Group today announced the addition of ultrasonic sensors to...

Superior switching and improved reliability deliver power density improvements in a variety of challenging applications PHOENIX, Ariz. – Feb. 17,...

Mayfield Fund, Continental, Robert Bosch Venture Capital, and Existing Investors Join WRVI Capital in Financing Developer of Highest-Performing Power-Efficient Perception...

DULLES, VA, February 12, 2020 — GeneSiC Semiconductor’s next-generation 1200V G3R™SiC MOSFETs with RDS(ON) levels ranging from 20 mΩ to...

Linz/Vienna/Munich - 16/02/2021 –Candera, a leading provider of HMI design tools, next system, a renowned expert of customized haptic hardware...

Manchester, UK – 17 February 2021 – Rutronik UK is now stocking the Insight SiP ISP1907 series of Bluetooth Low...

Monheim am Rhein, Germany – 15th February 2021 SEGGER announces its Embedded Studio build for the newly released Apple M1,...

16th February 2021 – Further progressing its goal of making battery-less technology more commonplace, e-peas has gained another big win...

New isolated gate driver board delivers compact, high-performance design for power modules AUSTIN, Texas – February 17, 2021 – Silicon...