The Quad Small Form Factor Pluggable Double Density (QSFP-DD) Multi Source Agreement (MSA) group has released an updated 3.0 Hardware...

Tokyo-based Showa Denko K.K. (SDK) has decided to expand its facilities for producing high-quality-grade silicon carbide (SiC) epitaxial wafers for...

Deposition equipment maker Aixtron SE of Herzogenrath, near Aachen, Germany has received an order for multiple metal-organic chemical vapor deposition...

North Carolina State University (NCSU) is rolling out a new manufacturing process and chip design for silicon carbide (SiC) power...

Norstel AB of Norrköping, Sweden has developed low-defect-density 150mm silicon carbide (SiC) n-type substrates. Norstel manufactures conductive (n-type) and semi-insulating...

The 100G Lambda Multi-Source Agreement (MSA) Group has announced their intent to develop specifications based on 100Gbps per wavelength optical...

Evatec Ltd of Trübbach, Switzerland (which makes thin-film deposition and etch processing equipment for advanced packaging, power device, MEMS, optoelectronics,...

The Compound Semiconductor Centre (CSC) - a joint venture between Cardiff University and epiwafer foundry and substrate maker IQE plc...

BluGlass Ltd of Silverwater, Australia says that its upgraded BLG-300 chamber has demonstrated RPCVD deposition uniformity within its targets for...

A discovery by two scientists at the Energy Department's National Renewable Energy Laboratory (NREL) could aid the development of next-generation...