Ayar Labs to Showcase the Future of AI Infrastructure with Fujitsu, Intel Foundry, Corning, and Altera
The company will demonstrate the breadth of its ecosystem and value of optical I/O in advancing AI infrastructure at Supercomputing...
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congatec and Canonical announce partnership
Offering the best Ubuntu Pro experience on congatec aReady.COMs Alexander Lehmann (Sales Director – IoT, Canonical), Joe Dulin (VP of...
OptiMOS™ Linear FET 2 MOSFET enables optimal hot-swap and battery protection
Munich, Germany – 13 November 2024 – The safe hot-swap operation in AI servers and telecom requires MOSFETs with a...
onsemi and Würth Elektronik Advance High-Accuracy Virtual Design of Power Electronic Applications
Power loss model generator now includes passive components to more accurately model designs and enable customers to go to market...
Mouser Explores the Open-Source Future with RISC-V Technology Resource Center
November, 2024 – Mouser Electronics, Inc., Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest...
Mouser Electronics Examines the Human-Centric Revolution of Industry 5.0
Exploring the Opportunities of a Sustainable and Resilient Industrial Future November, 2024 – Mouser Electronics, Inc., the global authorized distributor...
Keystone Electronics PTFE Insulated Terminals & Pins
New Hyde Park, NY… Press-in type PTFE (Teflon) Insulated Terminals for high temperature and high-quality terminal and connector applications are...
SoftBank Corp. and Fujitsu Strengthen Partnership for Realization of AI-RAN Commercialization
SoftBank Corp. (Note 1) ("SoftBank") and Fujitsu Limited (Note 2) ("Fujitsu") signed a memorandum of understanding on October 25, 2024,...
Murata Expands Combined Gyro and Accelerometer 6DoF Sensor Family with Revolutionary Automotive Solution
Hoofddorp, Netherlands: Murata is expanding its range of innovative Six Degrees-of-Freedom devices with the introduction of the SCH1633-D01. The micro-electromechanical system...
Renesas Introduces New AnalogPAK Programmable Mixed-Signal ICs
Devices Reduce Component Count, BOM Cost and Board Space in Almost Any Application TOKYO, Japan, November 12, 2024 ― Renesas...
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