Siemens wins Best of Show Award for “Packaging: Design” at 2026 Chiplet Summit
Siemens’ Innovator3D IC software recognized for advancing 2.5D and 3D chiplet integration Siemens has won in the “Packaging: Design” category ...
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Tag: Chiplet ecosystem
Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era
Scalability and functional safety enabled by chiplet technology Auto-grade quality for large, modern AI NPUs Advanced power control for higher ...
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Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market
Strategic collaborations with Samsung Foundry, Arm and others enable Cadence to deliver pre-validated chiplet solutions based on the Cadence Physical ...
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