Infineon and ROHM collaborate on silicon carbide power electronics packages
Business & Financial Press Sep 25, 2025 Infineon and ROHM sign Memorandum of Understanding to enable each other as a ...
Read moreBusiness & Financial Press Sep 25, 2025 Infineon and ROHM sign Memorandum of Understanding to enable each other as a ...
Read moreCreating a European Hub for Next-Gen Robotics, Power Electronics and EMS. Mumbai, 19th September 2025: Hind Rectifiers Limited, a leading ...
Read moreAutomotive-qualified CCPAK1212 packages increase power density in 48 V designs Nijmegen, September 18, 2025: Nexperia today announced the launch of their ...
Read moreCost-efficient micro-lead portfolio combines safety with enhanced design flexibility using standard footprint package solutions Nijmegen, September 11, 2025: Nexperia today introduced ...
Read moreMunich, Germany – 5 June 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced a collaboration with ...
Read moreAEC-Q101-qualified SMD devices combine unmatched thermal stability and easy assembly Nijmegen, May 06, 2025: Nexperia today announced a range of ...
Read moreMunich, Germany – 5 May 2025 – To enable the next generation of solid-state power distribution systems, Infineon Technologies AG ...
Read moreMunich, Germany – 17 March 2025 – The 600 V CoolMOS™ 8 high-voltage superjunction (SJ) MOSFET product family from Infineon ...
Read moreMarch 6, 2025 TDK Corporation (TSE:6762) unveils the EPCOS EP9 series (ordering code: B82804E), which is more compact than the ...
Read moreBy Catherine De Keukeleire, Director of Reliability & Quality Assurance, Wide Bandgap, onsemi For decades, silicon (Si) has been the ...
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